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Dive into the research topics where Helmut Dr. Tews is active.

Publication


Featured researches published by Helmut Dr. Tews.


Archive | 2003

Method for producing a spacer structure

Helmut Dr. Tews


Archive | 2004

Field effect transistor used as control transistor comprises a doped channel region, doped connecting regions, a control region, and an electrical insulating region arranged between the control region and the channel region

Ronald Kakoschke; Helmut Dr. Tews


Archive | 2005

Verfahren zum Herstellen eines Feldeffekttransistors, Tunnel-Feldeffekttransistor und integrierte Schaltungsanordnung mit mindestens einem Feldeffekttransistor A method of manufacturing a field effect transistor, tunnel field-effect transistor and integrated circuit arrangement having at least one field effect transistor

Ronald Kakoschke; Helmut Dr. Tews


Archive | 2005

Verfahren zum Herstellen eines Feldeffekttransistors, Feldeffekttransistor und integrierte Schaltungsanordnung A method of manufacturing a field effect transistor, field effect transistor and integrated circuit arrangement

Ronald Kakoschke; Helmut Dr. Tews


Archive | 2004

A semiconductor device and manufacturing method thereof

Jürgen Dr. Holz; Klaus Schrüfer; Helmut Dr. Tews


Archive | 2004

Halbleiterbauelement sowie zugehöriges Herstellungsverfahren Semiconductor device and manufacturing method thereof

Jürgen Dr. Holz; Klaus Schrüfer; Helmut Dr. Tews


Archive | 2003

Feldeffekttransistor mit lokaler source-/drainisolation sowie zugehöriges herstellungsverfahren

Jürgen Dr. Holz; Klaus Schrüfer; Helmut Dr. Tews


Archive | 2002

Methods and structures to increase the structural density and the memory capacity in a semiconductor wafer

Albert Birner; Stephan Kudelka; Joern Luetzen; Helmut Dr. Tews; Rolf Weis


Archive | 2002

Verfahren und Strukturen zur Erhöhung der Strukturdichte und der Speicherkapazität in einem Halbleiterwafer

Albert Birner; Stephan Kudelka; Joern Luetzen; Helmut Dr. Tews; Rolf Weis


Archive | 2002

An etching process for increasing the structural size of main structures in a semiconductor substrate useful in semiconductor wafer production for increasing their structural density (thickness, sic) and storage capacity

Albert Birner; Stephan Kudelka; Joern Luetzen; Helmut Dr. Tews; Rolf Weis

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Rolf Weis

Infineon Technologies

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