Network


Latest external collaboration on country level. Dive into details by clicking on the dots.

Hotspot


Dive into the research topics where Jae-dong Lee is active.

Publication


Featured researches published by Jae-dong Lee.


Journal of The Electrochemical Society | 2002

Effects of nonionic surfactants on oxide-to-polysilicon selectivity during chemical mechanical polishing

Jae-dong Lee; Young-rae Park; Bo Un Yoon; Yong-Pil Han; Sang-rok Hah; Joo-Tae Moon

The effects of surfactants on oxide-to-polysilicon selectivity during chemical mechanical polishing have been investigated. Slurries with nonionic surfactants such as Brij surfactants, polyethylene oxide (PEO), and ethylene oxide-propylene oxide-ethylene oxide triblock copolymer enhanced oxide-to-polysilicon polishing selectivity. Although a current conventional oxide slurry has a low oxide-to-polysilicon selectivity of 0.5:1, slurries with nonionic surfactants show a higher selectivity due to a combined effect of adsorption and interfacial adhesion of added nonionic surfactant molecules on the polysilicon surface. The oxide-to-polysilicon selectivity of the Brij surfactant added slurry displayed a stronger dependency on the hydrophile-lipophile-balance (HLB) value than the type of alkyl group or the chain length of surfactants. Especially, Brij52 with low HLB value gave an oxide-to-polysilicon selectivity of 9.3, which is 17 times higher than the selectivity of a commercial oxide slurry. A high molecular weight polymeric surfactant such as PEO also gave a greater selectivity than a low molecular weight surfactant. In addition, slurries with nonionic surfactants reduce the final thickness variation effectively in damascene structure having a polysilicon stopping layer. The final thickness variation polished with the Brij52 added slurry was decreased to one fourth of that with the conventional oxide slurry only.


Archive | 2011

Method of manufacturing nonvolatile memory device and nonvolatile memory device manufactured by the method

Im-soo Park; Young-Hoo Kim; Chang-ki Hong; Jae-dong Lee; Daehong Eom; Sung-Jun Kim


Archive | 2008

Methods of fabricating a semiconductor device

Jong-Won Lee; Sang-Yeob Han; Chang-ki Hong; Bo-Un Yoon; Jae-dong Lee


Archive | 2001

Method of controlling wafer polishing time using sample-skip algorithm and wafer polishing using the same

Jae-dong Lee; Bo-Un Yoon; Kyoung-mo Yang; Sang-rok Hah


Archive | 2003

Chemical mechanical polishing slurry and chemical mechanical polishing method using the same

Jae-dong Lee; Bo-Un Yoon; Yong-Pil Han


Archive | 2004

Slurry compositions and CMP methods using the same

Jaekwang Choi; Jae-dong Lee; Chang-ki Hong


Archive | 2003

Chemical/mechanical polishing slurry, and chemical mechanical polishing process and shallow trench isolation process employing the same

Jong-Won Lee; Jae-dong Lee; Bo-Un Yoon; Sang-rok Hah


Archive | 2005

Slurry, chemical mechanical polishing method using the slurry, and method of forming metal wiring using the slurry

Sung-Jun Kim; Jeong-Heon Park; Chang-ki Hong; Jae-dong Lee


Archive | 2005

Slurry, chemical mechanical polishing method using the slurry, and method of forming a surface of a capacitor using the slurry

Seong-Kyu Yun; Kenichi Orui; Chang-ki Hong; Jae-dong Lee; Sung-Jun Kim; Haruki Nojo


Archive | 2008

Slurry compositions for selectively polishing silicon nitride relative to silicon oxide, methods of polishing a silicon nitride layer and methods of manufacturing a semiconductor device using the same

Jong-Won Lee; Sang-Yeob Han; Chang-Ki Hong; Jae-dong Lee

Collaboration


Dive into the Jae-dong Lee's collaboration.

Researchain Logo
Decentralizing Knowledge