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James P. Cruse

Applied Materials

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Publication

Featured researches published by James P. Cruse.

international conference on ic design and technology | 2004

Trends in gate stack engineering

Faran Nouri; Shreyas Kher; P. Narwankar; R. Sharangpani; S. Muthukrishnan; Philip A. Kraus; Khaled Ahmed; C. Olsen; Thai Cheng Chua; James P. Cruse; Steven Hung; Sang Ho Bae; A. Kang; G. Higashi; Gary E. Miner

MOSFET scaling requires an increase in the dielectric capacitance and hence a decrease in the dielectric electrical thickness. In this paper, we review the scaling trends for the gate dielectric and the gate electrode as the industry faces the challenges of introducing new materials into production.

Archive | 1997

Method and apparatus for monitoring processes using multiple parameters of a semiconductor wafer processing system

James P. Cruse

Archive | 2011

TWIN CHAMBER PROCESSING SYSTEM

Ming Xu; Andrew Nguyen; Evans Lee; Jared Ahmad Lee; James P. Cruse; Corie Lynn Cobb; Martin Jeff Salinas; Anchel Sheyner; Ezra Robert Gold; John W. Lane

Archive | 2010

Methods for processing substrates in process systems having shared resources

James P. Cruse; Dermot Cantwell; Ming Xu; Charles Hardy; Benjamin Schwarz; Kenneth S. Collins; Andrew Nguyen; Zhifeng Sui; Evans Lee

Archive | 2011

Methods and apparatus for calibrating flow controllers in substrate processing systems

James P. Cruse; John W. Lane; Mariusch Gregor; Duc Dang Buckius; Berrin Daran; Corie Lynn Cobb; Ming Xu; Andrew Nguyen

Archive | 2007

Method and apparatus for controlling gas flow to a processing chamber

Ezra Robert Gold; Richard Fovell; James P. Cruse; Jared Ahmad Lee; Bruno Geoffrion; Douglas A. Buchberger; Martin Jeff Salinas

Archive | 1995

Apparatus and method for attaining repeatable temperature versus time profiles for plasma heated interactive parts used in mass production plasma processing

Michael R. Rice; David W. Groechel; James P. Cruse; Kenneth S. Collins

Archive | 1999

Process monitoring apparatus and method

James P. Cruse

Archive | 2007

Plasma reactor with reduced electrical skew using a conductive baffle

Shahid Rauf; Kenneth S. Collins; Kallol Bera; Kartik Ramaswamy; Andrew Nguyen; Steven Shannon; Lawrence Wong; Satoru Kobayashi; Troy S. Detrick; James P. Cruse

Archive | 2007

Reactor for wafer backside polymer removal using plasma products in a lower process zone and purge gases in an upper process zone

Kenneth S. Collins; Hiroji Hanawa; Andrew Nguyen; Ajit Balakrishna; David Palagashvili; James P. Cruse; Jennifer Y. Sun; Valentin N. Todorow; Shahid Rauf; Kartik Ramaswamy; Gerhard Schneider; Imad Yousif; Martin Jeffrey Salinas

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Andrew Nguyen

Applied Materials

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Kartik Ramaswamy

Applied Materials

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Kenneth S. Collins

Applied Materials

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Ezra Robert Gold

Applied Materials

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Jared Ahmad Lee

Applied Materials

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Shahid Rauf

Applied Materials

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Hiroji Hanawa

Applied Materials

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Jennifer Y. Sun

Applied Materials

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Martin Jeffrey Salinas

Applied Materials

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Douglas A. Buchberger

Applied Materials

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