Jian Pang
Tokyo Institute of Technology
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Publication
Featured researches published by Jian Pang.
international solid-state circuits conference | 2016
Korkut Kaan Tokgoz; Shotaro Maki; Seitaro Kawai; Noriaki Nagashima; Jun Emmei; Masato Dome; Hisashi Kato; Jian Pang; Yoichi Kawano; Toshihide Suzuki; Taisuke Iwai; Yuuki Seo; Kimsrun Lim; Shinji Sato; Li Ning; Kengo Nakata; Kenichi Okada; Akira Matsuzawa
This paper presents a 56Gb/s 16-QAM 65nm CMOS transceiver using a W-band carrier. Two wideband IF signals are up- and downconverted simultaneously with 68GHz and 102GHz carriers. The transceiver achieves 56Gb/s data-rate with TX-to-RX EVM of -16.5dB within 0.1m distance. The transceiver consumes 260mW and 300mW from a 1V supply in TX and RX modes, respectively. This results in 10pJ/bit efficiency, which is a state-of-the-art-efficient high-data-rate mm-Wave CMOS transceiver.
asian solid state circuits conference | 2016
Rui Wu; Jian Pang; Yuuki Seo; Kento Kimura; Seitaro Kawai; Shinji Sato; Satoshi Kondo; Tomohiro Ueno; Nurul Fajri; Yasuaki Takeuchi; Tatsuya Yamaguchi; Ahmed Musa; Masaya Miyahara; Kenichi Okada; Akira Matsuzawa
A low-power and small-area 60-GHz CMOS transmitter with oscillator pulling mitigation is presented. The subharmonic injection locking technique for the suppression of pulling effects is analyzed and demonstrated. The transmitter fabricated in a 65nm CMOS process achieves 7.04-Gb/s data rate with an EVM performance of −25 dB in 16QAM. The whole transmitter consumes 210 mW from a 1.2-V supply and occupies a core area of 0.82 mm2 including a PLL.
international solid-state circuits conference | 2017
Jian Pang; Shotaro Maki; Seitarou Kawai; Noriaki Nagashima; Yuuki Seo; Masato Dome; Hisashi Kato; Makihiko Katsuragi; Kento Kimura; Satoshi Kondo; Yuki Terashima; Hanli Liu; Teerachot Siriburanon; Aravind Tharayil Narayanan; Nurul Fajri; Tohru Kaneko; Toru Yoshioka; Bangan Liu; Yun Wang; Rui Wu; Ning Li; Korkut Kaan Tokgoz; Masaya Miyahara; Kenichi Okada; Akira Matsuzawa
The 60GHz carrier with 9GHz bandwidth enables ultra-high-speed wireless communication in recent years [1–4]. To meet the demand from rapidly-increasing data traffic, the IEEE802.11ay standard is one of the most promising candidates aiming for 100Gb/s data-rate. Both higher-order digital modulation such as 128QAM and channel bonding at 60GHz are considered to be used in the IEEE802.11ay standard. However, the more severe requirements of LO feedthrough (LOFT) and image-rejection ratio (IMRR) have to be satisfied, so much higher accuracy in built-in calibration circuitry is required across the entire 9GHz spectrum for LOFT and I/Q imbalance calibration to achieve the required EVM.
symposium on vlsi circuits | 2017
Yun Wang; Bangan Liu; Hanli Liu; Aravind Tharayil Narayanan; Jian Pang; Ning Li; Torn Yoshioka; Yuki Terashima; Haosheng Zhang; Dexian Tang; Makihiko Katsuragi; Dae-Young Lee; Sungtae Choi; Rui Wu; Kenichi Okada; Akira Matsuzawa
A novel high-data-rate low-power spectrum-efficient 60GHz Bi-Phase-On-Off-Keying (BPOOK) transceiver is presented for indoor short-range IoT application targeting the common 60GHz spectrum mask used in IEEE 802.11ad/ WiGig standards. By employing bi-phase encoder and double-balanced mixer, the BPOOK transmitter spectrum is efficient to be compliant with 2-channel bonding spectrum mask. The proposed 60GHz OOK transceiver is fabricated in 65nm CMOS, achieves 3.0 Gb/s data-rate and −46 dBm sensitivity, while consuming a power of 100mW including the on-chip 60GHz synthesizer.
IEEE Journal of Solid-state Circuits | 2017
Rui Wu; Ryo Minami; Yuuki Tsukui; Seitaro Kawai; Yuuki Seo; Shinji Sato; Kento Kimura; Satoshi Kondo; Tomohiro Ueno; Nurul Fajri; Shoutarou Maki; Noriaki Nagashima; Yasuaki Takeuchi; Tatsuya Yamaguchi; Ahmed Musa; Korkut Kaan Tokgoz; Teerachot Siriburanon; Bangan Liu; Yun Wang; Jian Pang; Ning Li; Masaya Miyahara; Kenichi Okada; Akira Matsuzawa
This paper presents 64-quadrature amplitude modulation (QAM) 60-GHz CMOS transceivers with four-channel bonding capability, which can be categorized into a one-stream transceiver and a two-stream frequency-interleaved (FI) transceiver. The transceivers are both fabricated in a standard 65-nm CMOS technology. For the proposed one-stream transceiver, the TX-to-RX error vector magnitude (EVM) is less than −23.9 dB for 64-QAM wireless communication in all four channels defined in the IEEE 802.11ad/WiGig. The maximum communication distance with the full rate can reach 0.13 m for 64 QAM, 0.8 m for 16 QAM, and 2.6 m for QPSK using 14-dBi horn antennas. A data rate of 28.16 Gb/s is achieved in 16 QAM by four-channel bonding. The transmitter, receiver, and phase-locked loop consume 186, 155, and 64 mW, respectively. The core area of the transceiver is 3.9 mm2. For the proposed two-stream FI transceiver, four-channel bonding in 64 QAM is realized with a data rate of 42.24 Gb/s and an EVM of less than −23 dB. The front end consumes 544 mW in transmitting mode and 432 mW in receiving mode from a 1.2-V supply. The core area of the transceiver is 7.2 mm2.
european solid state device research conference | 2015
Ning Li; Takeshi Inoue; Takuichi Hirano; Jian Pang; Rui Wu; Kenichi Okada; Hitoshi Sakane; Akira Matsuzawa
Helium-3 ion irradiation technique is proposed to improve silicon substrate noise isolation by creating a local semi-insulated region with a resistivity over 1kΩ-cm in low-resistive silicon substrate. Noise isolation is improved about 10dB at 2GHz after helium-3 ion irradiation in a 180-nm CMOS process. A 90% noise reduction has been achieved in the measurement results for test structures with guard rings. The noise isolation can be kept even after annealing at 200°C for 1 hour.
radio frequency integrated circuits symposium | 2018
Jian Pang; Rui Wu; Yun Wang; Masato Dome; Hisashi Kato; Hongye Huang; Aravind Tharayil Narayanan; Hanli Liu; Bangan Liu; Takeshi Nakamura; Takuya Fujimura; Masaru Kawabuchi; Ryo Kubozoe; Tsuyoshi Miura; Daiki Matsumoto; Naoki Oshima; Keiichi Motoi; Shinichi Hori; Kazuaki Kunihiro; Tomoya Kaneko; Kenichi Okada
international solid-state circuits conference | 2018
Korkut Kaan Tokgoz; Shotaro Maki; Jian Pang; Noriaki Nagashima; Ibrahim Abdo; Seitaro Kawai; Takuya Fujimura; Yoichi Kawano; Toshihide Suzuki; Taisuke Iwai; Kenichi Okada; Akira Matsuzawa
custom integrated circuits conference | 2018
Bangan Liu; Huy Cu Ngo; Kengo Nakata; Wei Deng; Yuncheng Zhang; Junjun Qiu; Torn Yoshioka; Jun Emmei; Haosheng Zhang; Jian Pang; Aravind Tharayil Narayanan; Dongsheng Yang; Hanli Liu; Kenichi Okada; Akira Matsuzawa
IEICE Transactions on Electronics | 2018
Bangan Liu; Yun Wang; Jian Pang; Haosheng Zhang; Dongsheng Yang; Aravind Tharayil Narayanan; Dae Young Lee; Sung Tae Choi; Rui Wu; Kenichi Okada; Akira Matsuzawa