K. Arimoto

SOI-DRAM circuit technologies for low power high speed multigiga scale memories

This paper describes a silicon on insulator (SOI) DRAM which has a body bias controlling technique for high-speed circuit operation and a new type of redundancy for low standby power operation, aimed at high yield. The body bias controlling technique contributes to super-body synchronous sensing and body-bias controlled logic. The super-body synchronous sensing achieves 3.0 ns faster sensing than body synchronous sensing and the body-bias controlled logic realizes 8.0 ns faster peripheral logic operation compared with a conventional logic scheme, at 1.5 V in a 4 Gb-level SOI DRAM. The body-bias controlled logic also realizes a body-bias change current reduction of 1/20, compared with a bulk well-structure. A new type of redundancy that overcomes the standby current failure resulting from a wordline-bitline short is also discussed in respect of yield and area penalty.

An experimental 256-Mb DRAM with boosted sense-ground scheme

In developing the 256-Mb DRAM, the data retention characteristics must inevitably be improved. In order for DRAMs to remain the semiconductor device with the largest production volume in the 256-Mb era, we must develop a cost effective device with a small chip size and a large process tolerance. In this paper, we propose the BSG (boosted sense-ground) scheme for data retention and FOGOS (folded global and open segment bit-line) structure for chip size reduction. We have fabricated an experimental 256-Mb DRAM with these technologies and obtained a chip size of 304 mm/sup 2/ and a performance of 34 ns access time. >

A 34-ns 16-Mb DRAM with controllable voltage down-converter

A high-speed 16-Mb DRAM with high reliability is reported. A multidivided column address decoding scheme and a fully embedded sense-amplifier driving scheme were used to meet the requirements for high speed. A low-power hybrid internal power supply voltage converter with an accelerated life-test function is also proposed and was demonstrated. A novel substrate engineering technology, a retrograded well structure formed by a megaelectronvolt ion-implantation process, provides a simple process sequence and high reliability in terms of soft error and latch-up immunity. >

Circuit design techniques for low-voltage operating and/or giga-scale DRAMs

As use of battery-operated machines, such as hand-held computers and PDAs, becomes wider, low-voltage/low-power DRAMs are required. Low-voltage technologies are also required in giga-scale DRAMs with scaled-down voltage. This paper describes low-voltage circuit design techniques to meet these demands.

A 60-ns 3.3-V-only 16-Mbit DRAM with multipurpose register

A single 3.3-V 16-Mbit DRAM with a 135-mm/sup 2/ chip size has been fabricated using a 0.5- mu m twin-well process with double-metal wiring. The array architecture, based on the twisted-bit-line (TBL) array, includes suitable dummy and space word-line configurations which suppress the inter-bit-line noise and bring yield improvement. The multipurpose register (MPR) designed for the hierarchical data bus structure provides a line-mode test (LMT), copy write, and cache access capability. The LMT with on-chip test circuits using the MPR and a comparator creates a random test pattern and reduces the test time to 1/1000. A field shield isolation and a T-shaped stacked capacitor allow the layout of a 4.8- mu m/sup 2/ cell size with a storage capacitance of 35 fF. These techniques enable the 3.3-V 16-Mbit DRAM to achieve a 60-ns RAS access time and 300-mW power dissipation at 120-ns cycle time. >

Cell-plate line connecting complementary bit-line (C/sup 3/) architecture for battery-operated DRAMs

In low-voltage operating DRAMs, one of the most serious problems is how to maintain sufficient charge stored in the memory cell, which is concerned with the operating margin and soft error immunity. An array architecture called the cell-plate line connecting complementary bit-line (C/sup 3/) architecture, which realizes a large signal voltage on the bit-line pair and low soft error rate (SER) without degrading the reliability of the memory cell capacitor dielectric film, is proposed. This architecture requires no unique process technology and no additional chip area. With the test device using the 16-Mb DRAM process, a 130-mV signal voltage is observed at 1.5-V power supply with 1.6- mu m*3.2- mu m cell size. This architecture should open the path for the future battery-backup and/or battery-operated high-density DRAMs. >

High-speed/high-bandwidth design methodologies for on-chip DRAM core multimedia system LSI's

Recently, as multimedia large scale integrated devices (LSIs) have developed, there has been strongly increased demand for high-speed/high-bandwidth LSIs which integrate the DRAM core and logic elements (CPU etc.). However, the high-speed/high-bandwidth operation induces the large switching noise. This noise degrades the DRAMs operating margin, and especially its data retention characteristics. In this paper, we analyze the noise transmission model and propose DRAM and logic compatible design methodologies to maintain the reliability of high-speed/high-bandwidth system LSIs. We also show that good experimental results are obtained on the test device. Furthermore, we propose the most suitable V/sub DD//GND line scheme for on-chip DRAM system LSI.

A long data retention SOI-DRAM with the body refresh function

We have proposed a body refresh function and circuits for SOI DRAMs. The body refresh utilizes a swinging of the bit line and gives stable body potential, long dynamic data retention time and low power consumption without any increase in the chip area.

A well-synchronized sensing/equalizing method for sub-1.0-V operating advanced DRAMs

Proposes an advanced DRAM array driving technique which can achieve low-voltage operation, a well-synchronized sensing and equalizing method. This method sets the DRAM array free from the body effect, achieves a small influence of the short channel effect, and reduces the leakage current. The sense and restore amplifier and equalizer can operate rapidly under a low-voltage operating condition such as 1.0 V V/sub CC/. Therefore, one can make determining the V/sub th/ easy for the satisfaction of the high-speed, the low-power dissipation, and a simple device structure. The well-synchronized sensing and equalizing method is applicable to low-voltage operating DRAMs with capacity of 256 Mbits and more. >

A 1.2 V to 3.3 V wide-voltage-range DRAM with 0.8 V array operation

DRAM arrays operating with power supply below 1 V, with stable sensing and high speed are required for multi-media systems. Reduction of data-retention current is also important. The authors present two data-retention current reduction techniques: charge-transfer pre-sensing scheme (CTPS) with 1/2Vcc bit-line precharge; and non-reset row block control (NRBC). An experimental 32 Mb DRAM using these techniques is fabricated in a 0.25 /spl mu/m triple-well CMOS technology.