Kazushige Kanda

A new technique for measuring threshold voltage distribution in flash EEPROM devices

A new, simple test circuit for evaluating the reliability of flash EEPROM devices is described. It measures threshold voltage (V/sub th/) distributions of a large number of cell transistors with easy static operation similar to I-V curve measurement. Moreover, each cell transistor in a large array is selectable to measure static characteristics. This circuit makes it possible to measure the V/sub th/ distribution even in the negative region after erase operation for a NAND-type EEPROM.

A 120-mm/sup 2/ 64-Mb NAND flash memory achieving 180 ns/Byte effective program speed

Emerging application areas of mass storage flash memories require low cost, high density flash memories with enhanced device performance. This paper describes a 64 Mb NAND flash memory having improved read and program performances. A 40 MB/s read throughput is achieved by improving the page sensing time and employing the full-chip burst read capability. A 2-/spl mu/s random access time is obtained by using a precharged capacitive decoupling sensing scheme with a staggered row decoder scheme. The full-chip burst read capability is realized by introducing a new array architecture. A narrow incremental step pulse programming scheme achieves a 5 MB/s program throughput corresponding to 180 ns/Byte effective program speed. The chip has been fabricated using a 0.4-/spl mu/m single-metal CMOS process resulting in a die size of 120 mm/sup 2/ and an effective cell size of 1.1 /spl mu/m/sup 2/.

A 130-mm/sup 2/, 256-Mbit NAND flash with shallow trench isolation technology

Higher density flash memories for mass storage are attractive for application in the audio-video field, for example, in digital cameras and for voice recording. A 100 MB Flash records one hour CD-quality music. Improvements in video compression techniques are expected to realize gigabyte flash, enabling movies on silicon in the near future; a development that is expected to lead to rapidly rising demand for high-density flash. Both the low bit cost due to the small cell size and the high program and read performance are important factors for the high density flash. A NAND flash has potential advantages in those respects. Shallow trench isolation (STI) shrinks bit line pitch to 73% of that in the case of conventional LOCOS isolation, enabling 0.29 um/sup 2/ cell 0.25 /spl mu/m design rules. The 129.76 mm/sup 2/ chip is made possible by using NAND type memory cell and STI.

A 125-mm/sup 2/ 1-Gb NAND flash memory with 10-MByte/s program speed

A single 3-V only, 1-Gb NAND flash memory has been successfully developed. The chip has been fabricated using 0.13-/spl mu/m CMOS STI technology. The effective cell size including the select transistors is 0.077 /spl mu/m/sup 2/. To decrease the chip size, a new architecture is introduced. The in-series connected memory cells are increased from 16 to 32. Furthermore, as many as 16 k memory cells are connected to the same wordline. As a result, the chip size is decreased by 15%. A very small die size of 125 mm/sup 2/ and an excellent cell area efficiency of 70% are achieved. As for the performance, a very fast programming and serial read are realized. The highest program throughput ever of 10.6-MByte/s is realized: 1) by quadrupling the page size and 2) by newly introducing a write cache. In addition, the garbage collection is accelerated to 9.4-MByte/s. In addition, the write cache accelerates the serial read operation and a very fast 20-MByte/s read throughput is realized.

A 120mm 2 16Gb 4-MLC NAND Flash Memory with 43nm CMOS Technology

NAND flash memory use in digital still cameras and cellular phones is driving demand for larger-capacity storage. Moreover, NAND flash has the potential to replace HDDs. To achieve larger capacity while maintaining low cost per bit, technical improvements in feature size and area reduction are essential. To meet the stringent requirements, we develop a 16 Gb 4-level NAND flash memory in 43 nm CMOS technology. In 43 nm generation, gate-induced drain leakage (GIDL) influences the electrical field on both sides of NAND strings. GIDL causes severe program disturb problems to NAND flash memories. To avoid GIDL, two dummy wordlines (WL) on both sides of NAND strings are added. This is effective because the dummy gate voltages, are selected independent of the program inhibit voltage.

A source-line programming scheme for low voltage operation NAND flash memories

To realize a low-voltage operation NAND flash memory, a new source-line programming scheme has been proposed. This architecture drastically reduces the program disturbance without circuit area, manufacturing cost, program speed, or power consumption overhead. In order to improve the program disturbance characteristics, a high program inhibit voltage is applied to the channel from the source line, as opposed to from the bit line of the conventional scheme. The bit-line swing is decreased to 0.5 V to achieve a lower power consumption. Although the conventional NAND flash memory cannot operate below 2.0 V due to the program disturbance issue, the proposed NAND flash memory shows excellent program disturbance characteristics irrespective of the supply voltage. A very fast programming of 192 /spl mu/s/page and a very low power operation of 22 mW at 1.4 V can be realized in the proposed scheme.

A 120 mm/sup 2/ 64 Mb NAND flash memory achieving 180 ns/byte effective program speed

Rapidly increasing solid-state mass-storage application areas are requiring low cost, high density flash memories with higher read and program throughputs. This paper describes a 3.3 V-only 64 Mb NAND flash memory fabricated using a 0.4 /spl mu/m single-metal CMOS technology. The read throughput of 40 MB/s is achieved by improving the random access time and by introducing a full-chip burst read. A typical program throughput of 5 MB/s corresponding to 180 ns/byte is achieved by using a narrow incremental step pulse programming (NISPP) technique. A staggered row decoder scheme relaxes layout limitations and improves the random access time.

A 19 nm 112.8 mm

NAND flash memory is widely used in digital cameras, USB devices, cell phones, camcorders and solid-state drives. Continuous lowering of bit cost, increasing flash-memory-die densities and improving performance have helped to expand flash markets. Recently, there are two different directions to meet market demands. One is lowering bit cost and increase memory density to the utmost limit, which is achieved by 4b/cell [1] or 3b/cell [2]. The other is focusing on high performance and high reliability. To meet both demands, we develop a 19nm 112.8mm2 64Gb 2b/cell NAND flash memory with the smallest die size ever reported. 15MB/s programming throughput and 400Mb/s/pin 1.8V Toggle Mode interface [3] are achieved for the first time. Die Micrograph and features are shown in Figure 25.1.1.

^{2}

A sophisticated bit-by-bit verifying scheme, which is able to realize a tight programmed threshold voltage distribution of 0.8 V, has been proposed for NAND EEPROMs. A new bit-by-bit verifying circuit is composed of a conventional sense amplifier and a dynamic latch circuit with only three transistors, increasing the chip size of the 64 Mbit NAND EEPROM less than 1%.

64 Gb Multi-Level Flash Memory With 400 Mbit/sec/pin 1.8 V Toggle Mode Interface

An embedded DRAM using a standard NAND flash memory process has been demonstrated for the first time. This embedded DRAM without extra costly manufacturing process realizes 2.4 mm2 /Mb macro density and provides large-capacity on-chip page buffers and data caches for NAND flash memories to enhance their performances. A 32 KB DRAM buffer macro with 1.5 μm2cell has been fabricated with a 32 nm NAND flash memory process. Even with small 3 fF cell using a planar MOS capacitor, an enough ±100 mV cell signal has been obtained by introducing a technique to self-boost cell node up to 4 V using a merit of high-voltage NAND flash process, and two techniques to curtail parasitic bitline capacitance down to 60 fF at 128 wordlines per bitline. An undershoot problem of cell nodes due to unwanted plateline bounce is resolved by a two-step-rise/fall wordline scheme. Installation of dummy cell scheme to obtain a half of “1” data (not an average of “1” and “0” data) cuts out 32 KB macro size by 1.3% while suppressing mismatch to 3 mV at the grounded bitline precharge. The 32 KB test vehicle shows 90 ns random cycle time with 15 ns burst cycle time (66 Mb/s/pin). The measured characteristics of 2 × 10-18 bit error rater (BER) by soft error and 10 ms data retention at 85 °C are enough for page buffer application in a NAND flash memory. The measured active current of 32 KB macro is 7 mA at 90 ns random cycle, but only 3.2 mA at practical use of 15 ns burst with 256B page access.