Kenichi Imamiya

A 5-V-only operation 0.6- mu m flash EEPROM with row decoder scheme in triple-well structure

An experimental 4-Mb flash EEPROM has been developed based on 0.6- mu m triple-well CMOS technology in order to establish circuit technology for high-density flash memories. A cell size of 2.0*1.8 mu m/sup 2/ has been achieved by using a negative-gate-biased source erase scheme and a self-aligned source (SAS) process technology. A newly developed row decoder with a triple-well structure has been realized in accordance with its small cell size. The source voltage during the erase operation was reduced by applying a negative voltage to the word line, which results in a 5-V-only operation. The chip size of the 4-Mb flash EEPROM is 8.11*6.95 mm/sup 2/, and the estimated chip size of a 16-Mb flash EEPROM is 98.4 mm/sup 2/ by using the minimal cell size (2.0*10 mu m/sup 2/). >

A 70nm 16Gb 16-level-cell NAND Flash Memory

A 16 Gb 16-level-cell (16LC) NAND flash memory using 70 nm design rule has been developed. This 16LC NAND flash memory can store 4 bits in a cell which enabled double bit density comparing to 4-level-cell (4LC) NAND flash with the same design rule. New programming method achieves 0.62 MB/s programming throughput.

A 70 nm 16 Gb 16-Level-Cell NAND flash Memory

A 16 Gb 16-level-cell (16LC) NAND flash memory using 70 nm design rule has been developed . This 16LC NAND flash memory can store 4 bits in a cell which enabled double bit density comparing to 4-level-cell (4LC) NAND flash, and quadruple bit density comparing to single-bit (SLC) NAND flash memory with the same design rule. New programming method suppresses the floating gate coupling effect and enabled the narrow distribution for 16LC. The cache-program function can be achievable without any additional latches. Optimization of programming sequence achieves 0.62 MB/s programming throughput. This 16-level NAND flash memory technology reduces the cost per bit and improves the memory density even more.

A negative V/sub th/ cell architecture for highly scalable, excellently noise-immune, and highly reliable NAND flash memories

A new, negative V/sub th/ cell architecture is proposed where both the erased and the programmed state have negative V/sub th/. This architecture realizes highly scalable, excellently noise-immune, and highly reliable NAND flash memories. The program disturbance that limits the scaling of a local oxidation of silicon (LOCOS) width in a conventional NAND-type cell is drastically reduced. As a result, the scaling limit of the LOCOS width decreases from 0.56 to 0.45 /spl mu/m, which leads to 20% isolation width reduction. The proposed cell is essential for the future scaled shallow trench isolated cells because improved program disturb characteristics can be obtained irrespective of the process technology or feature size. New circuit techniques, such as a PMOS drive column latch and a V/sub cc/-bit-line shield sensing method are also utilized to realize the proposed cell operation. By using these novel circuit technologies, array noise, such as a source-line noise and an inter bit line capacitive coupling noise, are eliminated. Consequently, the V/sub th/ fluctuation due to array noise is reduced from 0.7 to 0.1 V, and the V/sub th/ distribution width decreases from 1.2 to 0.6 V. In addition to the smaller cell size and the high noise immunity, the proposed cell improves device reliability. The read disturb time increases by more than three orders of magnitude, and a highly reliable operation can be realized.

A novel sense amplifier for flexible voltage operation NAND flash memories

This paper proposes a new bit-by-bit verify circuit for application in NAND flash memories. The Sense Amplifier (S/A) employed confers two benefits: flexible power supply voltage (ex. 3 V or 5 V) operation with a high noise immunity and an intelligent page copy function. The benefits are very useful to the flash memory card or system and accelerate the replacement of magnetic memories by flash memories. The S/A has been successfully implemented in the commercial version of the 32 Mbit NAND-EEPROM, in which the S/A is newly introduced in comparison with the prototype version.

A 130-mm/sup 2/, 256-Mbit NAND flash with shallow trench isolation technology

Higher density flash memories for mass storage are attractive for application in the audio-video field, for example, in digital cameras and for voice recording. A 100 MB Flash records one hour CD-quality music. Improvements in video compression techniques are expected to realize gigabyte flash, enabling movies on silicon in the near future; a development that is expected to lead to rapidly rising demand for high-density flash. Both the low bit cost due to the small cell size and the high program and read performance are important factors for the high density flash. A NAND flash has potential advantages in those respects. Shallow trench isolation (STI) shrinks bit line pitch to 73% of that in the case of conventional LOCOS isolation, enabling 0.29 um/sup 2/ cell 0.25 /spl mu/m design rules. The 129.76 mm/sup 2/ chip is made possible by using NAND type memory cell and STI.

A 4-Mbit CMOS EPROM

A high-density (512K-word/spl times/8-b) erasable programmable read-only memory (EPROM) has been designed and fabricated by using 0.8-/spl mu/m n-well CMOS technology. A novel chip layout and a sense-amplifier circuit produce a 120-ns access time and a 4-mA operational supply current. The interpoly dielectric, composed of a triple-layer structure, realizes a 10-/spl mu/s/byte fast programming time, in spite of scaling the programming voltage V/SUB PP/ from 12.5 V for a 1-Mb EPROM to 10.5 V for this 4-Mb EPROM. To meet the increasing demand for a one-time programmable (OTP) ROM, a circuit is implemented to monitor the access time after the assembly. A novel redundancy scheme is incorporated to reduce additional tests after the laser fuse programming. Cell size and chip size are 3.1/spl times/2.9 /spl mu/m/SUP 2/ and 5.86/spl times/14.92 mm/SUP 2/, respectively.

A 125-mm/sup 2/ 1-Gb NAND flash memory with 10-MByte/s program speed

A single 3-V only, 1-Gb NAND flash memory has been successfully developed. The chip has been fabricated using 0.13-/spl mu/m CMOS STI technology. The effective cell size including the select transistors is 0.077 /spl mu/m/sup 2/. To decrease the chip size, a new architecture is introduced. The in-series connected memory cells are increased from 16 to 32. Furthermore, as many as 16 k memory cells are connected to the same wordline. As a result, the chip size is decreased by 15%. A very small die size of 125 mm/sup 2/ and an excellent cell area efficiency of 70% are achieved. As for the performance, a very fast programming and serial read are realized. The highest program throughput ever of 10.6-MByte/s is realized: 1) by quadrupling the page size and 2) by newly introducing a write cache. In addition, the garbage collection is accelerated to 9.4-MByte/s. In addition, the write cache accelerates the serial read operation and a very fast 20-MByte/s read throughput is realized.

A 35 ns cycle time 3.3 V only 32 Mb NAND flash EEPROM

A 32 Mb NAND type flash EEPROM in 0.425 /spl mu/m CMOS achieves 35 ns cycle time for data read-out and programming data load by adopting a pipeline scheme. Metal-strapped select gates and boosted word line reduce read-out access time. Tight-programmed cell Vth distribution can be realized by program verify, using a simplified data register circuit. Multiple blocks can be erased at the same time by adopting erase block registers for each block. Simultaneous-erase verify for one block reduces total erase time. All funtions require only 3.3 V power supply.

A source-line programming scheme for low voltage operation NAND flash memories

To realize a low-voltage operation NAND flash memory, a new source-line programming scheme has been proposed. This architecture drastically reduces the program disturbance without circuit area, manufacturing cost, program speed, or power consumption overhead. In order to improve the program disturbance characteristics, a high program inhibit voltage is applied to the channel from the source line, as opposed to from the bit line of the conventional scheme. The bit-line swing is decreased to 0.5 V to achieve a lower power consumption. Although the conventional NAND flash memory cannot operate below 2.0 V due to the program disturbance issue, the proposed NAND flash memory shows excellent program disturbance characteristics irrespective of the supply voltage. A very fast programming of 192 /spl mu/s/page and a very low power operation of 22 mW at 1.4 V can be realized in the proposed scheme.