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Kenny King-Tai Ngan

Applied Materials

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Publication

Featured researches published by Kenny King-Tai Ngan.

Archive | 1997

Use of pulsed-DC wafer bias for filling vias/trenches with metal in HDP physical vapor deposition

Tse-Yong Yao; Zheng Xu; Kenny King-Tai Ngan; Xing Chen; John Urbahn; Lawrence P. Bourget

Archive | 1995

Method for the formation of tin barrier layer with preferential (111) crystallographic orientation

Jaim Nulman; Kenny King-Tai Ngan

Archive | 1999

Reactive plasma etch cleaning of high aspect ratio openings

Barney M. Cohen; Jingang Su; Kenny King-Tai Ngan

Archive | 1995

End effector for semiconductor wafer transfer device and method of moving a wafer with an end effector

Dan Marohl; Kenny King-Tai Ngan

Archive | 1993

Barrier layers and aluminum contacts

Kenny King-Tai Ngan; Edith Ong

Archive | 2002

Method and apparatus for balancing an electrostatic force produced by an electrostatic chuck

David Loo; Jr-Jyan Chen; Kenny King-Tai Ngan; Bradley O. Stimson

Archive | 2002

Precleaning process for metal plug that minimizes damage to low-κ dielectric

Barney M. Cohen; Suraj Rengarajan; Kenny King-Tai Ngan

Archive | 1996

Avoiding contamination from induction coil in ionized sputtering

Kenny King-Tai Ngan

Archive | 2004

Polishing pad conditioner with shaped abrasive patterns and channels

Venkata R. Balagani; George Lazari; Kenny King-Tai Ngan

Archive | 2004

Polishing pad conditioner and methods of manufacture and recycling

Trung T. Doan; Venkata R. Balagani; Kenny King-Tai Ngan

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Collaboration

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Jaim Nulman

Applied Materials

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Seshadri Ramaswami

Applied Materials

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Barney M. Cohen

Applied Materials

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Zheng Xu

Applied Materials

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Murali Narasimhan

Applied Materials

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Bradley O. Stimson

Applied Materials

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Jingang Su

Applied Materials

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Jr-Jyan Chen

Applied Materials

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Xiangbing Li

Applied Materials

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Trung T. Doan

Applied Materials

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