Seshadri Ramaswami

Copper target for sputter deposition

Method of forming a barrier layer which enables a consistently highly oriented crystalline structure in a metallic interconnect

Method of producing smooth titanium nitride films having low resistivity

Continuous, non-agglomerated adhesion of a seed layer to a barrier layer

Target for use in magnetron sputtering of aluminum for forming metallization films having low defect densities and methods for manufacturing and using such target

Target for use in magnetron sputtering of nickel for forming metallization films having consistent uniformity through life

Method of enhancing hardness of sputter deposited copper films

Sputtering method to generate ionized metal plasma using electron beams and magnetic field

Method and apparatus for improving sidewall coverage during sputtering in a chamber having an inductively coupled plasma

Ti/Tinx underlayer which enables a highly oriented aluminum interconnect