Luigi Gaioni

Development of deep N-well MAPS in a 130 nm CMOS technology and beam test results on a 4k-pixel matrix with digital sparsified readout

We report on further developments of our recently proposed design approach for a full in-pixel signal processing chain of deep n-well (DNW) MAPS sensors, by exploiting the triple well option of a CMOS 0.13 μm process. The optimization of the collecting electrode geometry and the re-design of the analog circuit to decrease power consumption have been implemented in two versions of the APSEL chip series, namely “APSEL3T1” and “APSEL3T2”. The results of the characterization of 3x3 pixel matrices with full analog output with photons from 55Fe and electrons from 90Sr are described. Pixel equivalent noise charge (ENC) of 46 e- and 36 e- have been measured for the two versions of the front-end implemented toghether with signal-to-noise ratios between 20 and 30 for Minimum Ionizing Particles. In order to fully exploit the readout capabilities of our MAPS, a dedicated fast readout architecture performing on-chip data sparsification and providing the timing information for the hits has been implemented in the prototype chip “APSEL4D”, having 4096 pixels. The criteria followed in the design of the readout architecture are reviewed. The implemented readout architecture is data-driven and scalable to chips larger than the current one, which has 32 rows and 128 columns. Tests concerning the functional characterization of the chip and response to radioactive sources have shown encouraging preliminary results. A successful beam test took place in September 2008. Preliminary measurements of the APSEL4D charge collection efficiency and resolution confirmed the DNW device is working well. Moreover the data driven approach of the readout chips has been successfully used to demonstrate the possibility to build a Level 1 trigger system based on Associative Memories.

Mechanisms of Noise Degradation in Low Power 65 nm CMOS Transistors Exposed to Ionizing Radiation

Experimental data provide insight into the mechanisms governing the impact of gate and lateral isolation dielectrics and of scaling-related technological advances on noise and its sensitivity to total ionizing dose effects in Low Power 65 nm CMOS devices. The behavior of the 1/f noise term is correlated with the effects on the drain current that irradiation brings along by turning on lateral parasitic transistors. A comparison with data from previous CMOS generations is carried out to assess the impact of process features on radiation-induced degradation effects.

TID Effects in Deep N-Well CMOS Monolithic Active Pixel Sensors

This paper is devoted to the study of total ionizing dose effects in deep N-well (DNW) CMOS monolithic active pixel sensors (MAPS) for particle tracking fabricated in a STMicroelectronics 130 nm process. DNW-MAPS samples were exposed to gamma-rays up to a final dose of 1100 krad(SiO2) and then subjected to a 100degC annealing cycle. Ionizing radiation tolerance was tested by monitoring the device noise properties and its response to charge injection through an external pulse generator throughout the irradiation and annealing campaign. The origins of performance degradation are discussed based on the results from radiation hardness characterization of single transistors belonging to the same CMOS technology and of test diodes reproducing the MAPS collecting electrode structure. Also circuit simulations have been performed to supply further evidence for the proposed degradation mechanisms.

Investigating Degradation Mechanisms in 130 nm and 90 nm Commercial CMOS Technologies Under Extreme Radiation Conditions

The purpose of this paper is to study the mechanisms underlying performance degradation in 130 nm and 90 nm commercial CMOS technologies exposed to high doses of ionizing radiation. The investigation has been mainly focused on their noise properties in view of applications to the design of low-noise, low-power analog circuits to be operated in harsh environment. Experimental data support the hypothesis that charge trapping in shallow trench isolation (STI), besides degrading the static characteristics of interdigitated NMOS transistors, also affects their noise performances in a substantial fashion. The model discussed in this paper, presented in a previous work focused on CMOS devices irradiated with a 10 Mrad(SiO2) gamma -ray dose, has been applied here also to transistors exposed to much higher (up to 100 Mrad(SiO2 )) doses of X-rays. Such a model is able to account for the extent of the observed noise degradation as a function of the device polarity, dimensions and operating point.

Comprehensive Study of Total Ionizing Dose Damage Mechanisms and Their Effects on Noise Sources in a 90 nm CMOS Technology

Irradiation tests on 90 nm CMOS devices at different total ionizing doses lead to new insights into degradation mechanisms in gate oxides and lateral isolation structures and into their impact on gate and drain current noise sources. The action of lateral parasitic transistors and their physical parameters are studied in different operating conditions. The main focus is on 1/f noise, which is one of the few parameters which are sizably affected by irradiation. Irradiation effects on the noise in the gate current are discussed in this paper for the first time. The analysis of the behavior of thick oxide I/O transistors provides a comparison both with thin oxide core devices and with previous, less scaled CMOS generations.

Recent development on triple well 130 nm CMOS MAPS with in-pixel signal processing and data sparsification capability

A different approach to the design of CMOS MAPS has recently been proposed. By exploiting the triple well option of a CMOS commercial process, a deep n-well (DNW) MAPS sensor has been realized with a full in-pixel signal processing chain: charge preamplifier, shaper, discriminator and a latch. This readout approach beeing compatible with data sparsification will improve the readout speed potential of MAPS sensors. The first protoype chips, realized with STMicroelectronics 130 nm triple well process, proved the new design proposed for DNW MAPS is viable with a good sensitivity to photons from 55Fe and electrons from 90Sr. Extensive tests performed to characterize the second generation of the APSEL chips based on the DNW MAPS design are reported. Small 3times3 pixel matrices with full analog output have been tested with radioactive sources to characterize charge collection. Pixel noise equivalent charge (ENC) of 50 e- and signal-to-noise ratio for MIPs of about 14 have been measured. Improved pixel noise and reduced threshold dispersion (about 100 e-) have been measured in the 8times8 matrix with a sequential readout. Based on the new DNW MAPS design a dedicated fast readout architecture to perform on-chip data sparsification is currently under development. The aim is to incorporate in the same detector the advantages of the thin CMOS sensors and similar functionalities as in hybrid pixels.

CHIPIX65: Developments on a new generation pixel readout ASIC in CMOS 65 nm for HEP experiments

Pixel detectors at HL-LHC experiments or other future experiments are facing new challenges, especially in terms of unprecedented levels of radiation and particle flux. This paper describes the progress made by the CHIPIX65 project of INFN for the development of a new generation readout ASIC using CMOS 65 nm technology.

The associative memory for the self-triggered SLIM5 silicon telescope

Modern experiments search for extremely rare processes hidden in much larger background levels. As the experiment complexity, the accelerator backgrounds and luminosity increase we need increasingly exclusive selections to efficiently select the rare events inside the huge background. We present a fast, high-quality, track-based event selection for the self-triggered SLIM5 silicon telescope. This is an R&D experiment whose innovative trigger will show that high rejection factors and manageable trigger rates can be achieved using fine-granularity, low-material tracking detectors.

Macro Pixel ASIC (MPA): the readout ASIC for the pixel-strip (PS) module of the CMS outer tracker at HL-LHC

The CMS tracker at HL-LHC is required to provide prompt information on particles with high transverse momentum to the central Level 1 trigger. For this purpose, the innermost part of the outer tracker is based on a combination of a pixelated sensor with a short strip sensor, the so-called Pixel-Strip module (PS). The readout of these sensors is carried out by distinct ASICs, the Strip Sensor ASIC (SSA), for the strip layer, and the Macro Pixel ASIC (MPA) for the pixel layer. The processing of the data directly on the front-end module represents a design challenge due to the large data volume (30720 pixels and 1920 strips per module) and the limited power budget. This is the reason why several studies have been carried out to find the best compromise between ASICs performance and power consumption. This paper describes the current status of the MPA ASIC development where the logic for generating prompt information on particles with high transverse momentum is implemented. An overview of the readout method is presented with particular attention on the cluster reduction, position encoding and momentum discrimination logic. Concerning the architectural studies, a software test bench capable of reading physics Monte-Carlo generated events has been developed and used to validate the MPA design and to evaluate the MPA performance. The MPA-Light is scheduled to be submitted for fabrication this year and will include the full analog functions and a part of the digital logic of the final version in order to qualify the chosen VLSI technology for the analog front-end, the module assembly and the low voltage digital supply.

2D and 3D thin pixel technologies for the Layer0 of the SuperB Silicon Vertex Tracker

The high luminosity asymmetric e+e− collider SuperB, recently approved by the Italian Government, is designed to deliver a luminosity greater than 1036cm−2s−1 with moderate beam currents and a reduced center of mass boost with respect to earlier B-Factories. An improved vertex resolution is required for precise time-dependent measurements and the SuperB Silicon Vertex Tracker will be equipped with an innermost layer of small radius (about 1.5 cm), resolution of 10 µm in both coordinates, low material budget (< 1% X0), and able to withstand a hit background rate of several tens of MHz/cm2. The ambitious goal of designing a thin pixel device matching these stringent requirements is being pursued with specific R&D programs on different technologies: CMOS MAPS, pixel sensors in vertical integration technology and hybrid pixels with small pitch and reduced material budget. The latest results on the characterization of the various pixel devices realized for the SuperB Layer0 will be presented.