M. Maeng

Design of compact stacked-patch antennas in LTCC multilayer packaging modules for wireless applications

A simple procedure for the design of compact stacked-patch antennas is presented based on LTCC multilayer packaging technology. The advantage of this topology is that only one parameter, i.e., the substrate thickness (or equivalently the number of LTCC layers), needs to be adjusted in order to achieve an optimized bandwidth performance. The validity of the new design strategy is verified through applying it to practical compact antenna design for several wireless communication bands, including ISM 2.4-GHz band, IEEE 802.11a 5.8-GHz, and LMDS 28-GHz band. It is shown that a 10-dB return-loss bandwidth of 7% can be achieved for the LTCC (/spl epsiv//sub r/=5.6) multilayer structure with a thickness of less than 0.03 wavelengths, which can be realized using a different number of laminated layers for different frequencies (e.g., three layers for the 28-GHz band).

Realization of multigigabit channel equalization and crosstalk cancellation integrated circuits

In this paper, we present integrated circuit solutions that enable high-speed data transmission over legacy systems such as short reach optics and electrical backplanes. These circuits compensate for the most critical signal impairments, intersymbol interference and crosstalk. The finite impulse response (FIR) filter is the cornerstone of our architecture, and in this study we present 5- and 10-Gsym/s FIR filters in 2-/spl mu/m GaAs HBTs and 0.18-/spl mu/m CMOS, respectively. The GaAs FIR filter is used in conjunction with spectrally efficient four-level pulse-amplitude modulation to demonstrate 10-Gb/s data throughput over 150 m of 500 MHz/spl middot/km multimode fiber. The same filter is also used to demonstrate equalization and crosstalk cancellation at 5 Gb/s on legacy backplane. The crosstalk canceller improves the bit error rate by five orders of magnitude. Furthermore, our CMOS FIR filter is tested and demonstrates backplane channel equalization at 10 Gb/s. Finally, building blocks for crosstalk cancellation at 10 Gb/s are implemented in a 0.18-/spl mu/m CMOS process. These circuits will enable 10-Gb/s data rates on legacy systems.

Equalization and near-end crosstalk (NEXT) noise cancellation for 20-Gb/s 4-PAM backplane serial I/O interconnections

Limitations in current backplane environments impede high-speed data transmission above 5 Gb/s. A system architecture to extend the transmission capacities of legacy backplanes is proposed. The incentives for using a four-level pulse amplitude modulation (4-PAM) scheme are also presented. The architecture is built from feed-forward equalizer and tunable filter elements for near-end crosstalk noise cancellation. Each of the circuits is implemented in a standard 0.18-/spl mu/m CMOS process. The building blocks of the architecture, which include an LC ladder, a modified Gilbert-cell multiplier with improved headroom, and a tunable active high-pass filter are described in detail. Results of the architecture are shown demonstrating 20-Gb/s 4-PAM signal transmission.

Design of compact stacked-patch antennas on LTCC technology for wireless communication applications

Stacked-patch antennas on LTCC (low temperature cofired ceramics) multilayer structures can be easily designed for optimal bandwidth performance by an adjustment of the number of LTCC layers. This paper presents a methodology suitable for the design of compact broadband antennas. It is demonstrated that a stacked-patch antenna on an LTCC substrate with a thickness of less than 0.03/spl lambda//sub 0/ can achieve a bandwidth of up to 7%, which may find applications in a number of wireless communication systems.

0.18-/spl mu/m CMOS equalization techniques for 10-Gb/s fiber optical communication links

Limitations in data transmission caused by modal dispersion in fiber-optic links can be significantly improved using equalization techniques. In this paper, two different equalizer implementation approaches are proposed to extend the transmission capacities of existing fiber-optic links. The building blocks of the equalizer including a multiplier cell, a delay line, and an output buffer stage are fully integrated on a 0.18-/spl mu/m CMOS process. For the continuous-time tap-delay implementation, a passive LC delay line and an active inductance peaking delay line are compared for performance against process variation, as well as power consumption. In addition, a delay-locked loop is proposed to counter delay variations caused by changes in the process corner. A 10-Gb/s nonreturn-to-zero signal is received after transmission through a 500-m multimode-fiber channel, and the signal impairment due to the differential modal delay is successfully compensated using both feed-forward equalizers.

Development of integrated 3D radio front-end system-on-package (SOP)

This paper presents the development and characterization of compact and highly integrated microwave and millimeter wave radio front-end Systems-on-Package (SOP). The three-dimensional transceiver front-end SOP architectures incorporate on-package integrated lumped element passives as well as RF functions primarily filters, baluns, and antennas in standard multi-layer LTCC and fully-organic technologies. An LTCC-based 14 GHz transmitter for satellite outdoor unit, an OC-192 transmitter incorporating Ku-band Optical Sub-Carrier Multiplexing (OSCM) technique as well fully-organic SOP transmission lines and lumped-element components have been demonstrated. These prototypes suggest the feasibility of developing highly miniaturized cost-effective SOP transceivers applicable not only for wireless but also for optoelectronics links.

A 2.4 GHz high efficiency SiGe HBT power amplifier with high-Q LTCC harmonic suppression filter

We present a 2.4 GHz SiGe HBT power amplifier integrated with a harmonic suppression filter implemented in a high-Q multilayer low-temperature cofired ceramic (LTCC) substrate at the output. The power amplifier delivers a power of up to 27.5 dBm with a maximum power-added efficiency (PAE) of 47%. It has a power output of 27 dBm at an input power of 0 dBm with a PAE of 45%. The second and third harmonics are -44 dBc and -49 dBc, respectively, at this operating point. The power amplifier exhibits a linear gain of 35 dB and operates at a supply voltage of 3.3 V. To the best of our knowledge, this represents the best reported performance of a SiGe HBT power amplifier at 2.4 GHz and is comparable to performance previously achieved only with GaAs-based processes. The harmonic suppression filter and output match network have been implemented completely in LTCC without the use of external discrete components.

System-on-Package (SOP) architectures for compact and low cost RF front-end modules

This paper presents the development of advanced System-on-Package (SOP) architectures for compact and low cost wireless RF wireless systems. We present the design of compact stacked patch antennas using SHS structures for LMDS and Vband applications. Multi-layer organic packaging development for SOP is reported. An Intelligent Network Communicator (INC) RF block is presented as example of the high performances of multi-layer organic package. A novel ultra-compact 3D integration technology for SOP-based solutions is proposed and utilized for the implementation of a Ku band VCO module. In addition, the fabrication of very high Qfactor inductors in Liquid Crystal Polymer multi-layer substrate demonstrate superior performances compared to any other multilayer organic packages.

A 10-Gb/s Reconfigurable CMOS Equalizer Employing a Transition Detector-Based Output Monitoring Technique for Band-Limited Serial Links

Limitations in data transmission caused by band limitation in broadband communication links can be improved significantly by using equalization techniques. In this paper, a reconfigurable feed-forward equalizer employing a transition detector (TD)-based calibration technique that provides a universal channel compensation solution is presented. Moreover, the newly proposed TD-based calibration technique monitors the channel output for further adjustments over time in order to provide optimum compensation in performance. The reconfigurable equalizer is implemented in a 0.18-mum CMOS technology. The prototype successfully demonstrates the feasibility of the TD-based calibration technique for output monitoring

RF-microwave multi-band design solutions for multilayer organic system on package integrated passives

We present multi-band design solutions for integrated passives using multilayer organic (MLO) process technology for RF and microwave System on Package (SOP) module development. The components developed in this technology include embedded high-Q compact inductors and filters designed in three frequency bands: S, C and Ku applicable for Bluetooth, MMDS, IEEE802.11a WLAN and satellite communications. Measured inductor Q-factor as high as 182 and Self-Resonant-Frequency (SRF) as high as 20 GHz, which represents the highest Q in its frequency range reported to date in a multilayer technology, have been demonstrated. A time domain electromagnetic modeling technique is also use to characterize the passive devices.