Michal Reznicek

Thick film double thermodynamic sensor system

This paper deals with a new family of thick film sensors used for thermodynamic monitoring and controlling of processes in industrial systems. In previous papers mentioned below the below mentioned basic principle of new thermodynamic sensor was introduced and its construction on alumina ceramic substrate was demonstrated. Generally, this sensor has plenty of application possibilities in various areas of industry sectors. Some final users especially from the RF area call for sensors that are independent from of contiguous environment effects. Such applications can be realized by using the double thermodynamic sensor probe. The basic principle of this solution is an external thermodynamic sensor that creates the thermodynamic environment shield for the internal sensor used for process monitoring inside the shielded area. Before implementation of the sensor system the simulation model of the double thermodynamic sensor as a particular element of the thermodynamic system was calculated. The values obtained from simulation (ANSYS, FLOMERICS) are compared and valuated with experimental results, and are shown in this paper. There is a good conformity between calculated and measured values. Results obtained from simulation enable construction of are used to construct a new family of double thermodynamic sensor probes in thermodynamic circuitry models, which are integrable in many industrial thermodynamic systems designed in standardized design environments (ANSYS, MATHCAD, FEMLAB etc.). They can be used as technical solutions in process and media monitoring for the controlling system integral design of any complex thermodynamics systems, namely automotive, power, heat distribution, food, chemical and petrochemical industry etc.

Innovation in microelectronics technology education

This paper deals with presentation of some new aspects in study program of Microelectronics Technology on Faculty of Electrical Engineering and Communication Technology at Brno University of Technology. Microelectronics technology education makes a part of new study program that there was introduced in last years. This study program consists from three levels, Bachelor, Master and Doctorate degree. Subjects concerning Microelectronics technology make the fix part of this program and they are more and more popular among students from reasons concerning the practical education process. This fact is based on some new teaching activities that were incorporated in curriculum of both, bachelor and master subjects as shown in this paper.

Segmented thermodynamic sensor in applications

Segmented thermodynamic sensor in temperature shift balance circuit as the power AC/DC transmitter and direct working sub-systems thermo interactivity in thermodynamic systems is described. This paper deals with new thick film sensor used for thermodynamic direct power AC/DC transmission and metering in active industrial systems. In previous papers the basic principle of thermodynamic sensor was introduced and its construction on alumina ceramic substrate with commercial thick film pastes was demonstrated. Generally this sensor has plenty of application possibilities in various areas of industry. Some final users especially from RF area are asking for galvanic isolated sensors independent to contiguous environment effects. Such applications can be realized by the bisected thermodynamic sensor probe. The basic principle of this solution is segmented thermodynamic sensor with the thermodynamic environment temperature shift between more active sensor sections to influence of ambient temperature compensation. The simulation model of segmented thermodynamic sensor as particular segment elements of thermodynamic system was simulated. Values obtained from simulation are compared and discussed with experimental results. There is a good conformity between calculated and measured values. Results obtained from simulations enables construction of new family of segmented thermodynamic sensor probes in balance circuitry models. These could be integrated into many industrial thermodynamic metering systems designed in standardized design environments. They can be used as technical solution in galvanic isolated power measuring systems in integral industrial designs of any complex thermodynamics systems. Namely power and heat distribution, overpower protection systems, thermal circuit breaking systems, HIRF detection systems, etc.

System for maintaining the dispensing capillary at a constant height above the surface

This article describes a system for maintaining the dispensing capillary at a constant height above the surface of the substrate. Used substrates are not sufficiently planar and it is therefore necessary to correct the height of the capillary during dispensing process (constant height with +/- 5 μm tolerance above substrate is necessary). Non-planarity of substrates is typically 150 microns over the entire surface.

Towards implementation of logic circuits based on intrinsically reconfigurable organic transistors

Nowadays, electronic circuits based on wide range of organic materials with semiconductor properties are still perceived as a somewhat unconventional design approach and fabrication technology. However, it could potentially deliver many significant advantages. Materials for organic electronics are typically lighter, flexible, easier to handle and less expensive in comparison with traditional inorganic materials used in electronics (e.g. copper and silicon used for conventional CMOS process). Previously reported research achievements in that particular domain also indicate that some of the organic semiconductor materials could be used for construction of organic field-effect transistors (OFET) that exhibit rather peculiar ability of ambipolar charge conduction. Fundamental electronic structures of such type also suggest the perspective of their utilization as the key building blocks for so called multifunctional logic elements or even more complex polymorphic circuits. In this paper, main focus is given to the introduction of organic transistor devices with the ambipolar property that would allow to further increase the efficiency of multifunctional circuit design and synthesis techniques. Important aspect depicting the novelty of the proposed approach is primarily based on the adoption of hybrid combination of the traditional silicon substrate with the deposition of suitable organic semiconductor layer. In addition, custom chip carrier platform was also developed for this purpose. Finally, the paper is concluded with review of the achieved results and suggestion of further research directions.

Innovative procedures for the evaluation method of the efficiency in the cleaning process

High-quality electronic assemblies, especially with “Fine Pitch” components, frequently need an effective but nonetheless environmentally friendly cleaning process. This paper deals with the development of an evaluation method of cleaning processes in microelectronics assembly technology. The elaboration of optimum parameters of the cleaning process for individual applications and the cleaning process efficiency as well as an innovative methodology based on the use of patented test substrates is in detail described in this paper.

New method for adjustment of elevation of the ceramic flatness for direct deposition

This paper deals with dispensing technology process, some times known “writing”, regarding high resolution deposition of thixotropic materials including standard conductor, resistor and dielectric thick film pastes with common viscosity values. The aim of this work is to achieve in the reproducible process the resolution below 100 μm. In this case, it is necessary to use a higher level of the optimization in comparison with standard conditions. Dispensing system for high resolution printing as a whole is to be divided into several categories. It is necessary to start from the preparation of the substrate and his elevation fixation with dispensing head. Due to the fact that the commercial supplied ceramic substrate for hybrid integrated circuits (usually alumina) does not meet the required geometric parameters for high precision printing inevitable to make a correction for curvature of the surface. While during the printing with common resolution 500 μm is not affected by the flatness of the ceramic surface, in the case of resolutions better than 200 μm (<; 100 μm) are subtle motifs practically impossible to print. To assure constant distance between ceramic surface and the dispensing unit is necessary to control Z axis level of the dispensing unit in conformity with corresponding actual value. This fact results from thixotropic materials physical behavior during the dispensing process, where distance fluctuation has to be smaller than 10 μm [1,2,3].

The Subject “Electronics Hardware” as interdisciplinary topic for the electric engineering education

This paper deals with the significant importance of the “Electronics Hardware” topic, which is introduced in the innovation program for Bachelor Study Program in the branch “Microelectronics and Technology” at Faculty of Electrical Engineering and Telecommunication (FEEC) in Brno University of Technology (BUT) in the Czech Republic. Importance of “Electronics hardware” knowledge is based upon the fact that mostly parts of engineers in all branches are in your praxis often in contact with electronics hardware. Electronics hardware ranges from individual chips to signal processing systems and instruments in various applications areas as communication and control equipments. These should be consumer, medical, automotive, informatics, telecommunication and many others. To manage hardware in the right way means to save cost, to assure quality and to care and protect about environment and human health. To help and create fundamentals in this way is the main contribution for the introducing this subject as interdisciplinary. The reason to involve this topic in the electric engineering education system is endorsed also by increasing interest of students from various branches for this topic in last three years of its introducing in education process. Detailed syllabus and lab exercises related to this topic are presented.

Thermodynamic sensors new opportunities for measuring and control in industrial applications

This paper deals with new developed thick film sensor based on powerful thermodynamic method using the high resistance ratio-metric sensor, which is improving the accuracy of the temperature measurement. This solution minimizes usual problems as dependance of sensors sensitivity from other factors as power supply instability, ambient temperature shift, humidity and pressure changes, effect of self heating, aging, etc.