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Dive into the research topics where Patrick Schmid is active.

Publication


Featured researches published by Patrick Schmid.


Materials Science Forum | 2016

Modelling of 4H-SiC VJFETs with Self-Aligned Contacts

Konstantinos Zekentes; Konstantin Vassilevski; A. Stavrinidis; G. Konstantinidis; M. Kayambaki; Konstantinos Vamvoukakis; Emmanouil Vassakis; Hervé Peyre; Nikolaos Makris; Matthias Bucher; Patrick Schmid; D. Stefanakis; D. H. Tassis

Purely vertical 4H-SiC JFETs have been modeled by using three different approaches: the analytical model, the finite element model and the compact model. The results of the modeling have been compared with experimental results on a series of fabricated self-aligned devices with two different channel lengths (0.3 and 1.1μm) and various channel widths (1.5, 2, 2.5, 3, 4 and 5 μm). For all the considered models I-V and C-V characteristics could be satisfactorily simulated.


Materials Science Forum | 2013

Impact of substrate steps and of monolayer-bilayer junctions on the electronic transport in epitaxial graphene on 4H-SiC (0001)

Filippo Giannazzo; Ioannis Deretzis; Antonino La Magna; Salvatore Di Franco; Nicolò Piluso; Patrick Fiorenza; Fabrizio Roccaforte; Patrick Schmid; Wilfried Lerch; Rositza Yakimova

Two dimensional maps of the electronic conductance in epitaxial graphene (EG) grown on SiC were obtained by conductive atomic force microscopy (CAFM). The correlation between morphological and electrical maps revealed the local conductance degradation in EG over the SiC substrate steps or at the junction between monolayer (1L) and bilayer (2L) graphene regions. The effect of steps strongly depends on the charge transfer phenomena between the step sidewall and graphene, whereas the resistance increase at 1L/2L junction is a purely quantum mechanical effect, due to the weak coupling between 1L and 2L electron wavefunctions.


Archive | 2001

Device for thermal treatment of substrates

Uwe Kreiser; Karsten Weber; Wilfried Lerch; Michael Grandy; Patrick Schmid; Juergen Niess; Olgun Altug


Archive | 2007

Method and system for thermally processing a plurality of wafer-shaped objects

Zsolt Nenyei; Paul Janis Timans; Wilfried Lerch; Jüergen Niess; Manfred Falter; Patrick Schmid; Conor Patrick O'carroll; Rudy Santo Tomas Cardema; Igor Fidelman; Sing-Pin Tay; Yao Zhi Hu; Daniel J. Devine


Archive | 2000

Vorrichtung zum thermischen Behandeln von Substraten

Uwe Kreiser; Juergen Nies; Wilfried Lerch; Olgun Altug; Michael Grandy; Karsten Weber; Patrick Schmid


Archive | 2006

Device and method for the reduction of particles in the thermal treatment of rotating substrates

Helmut Aschner; Patrick Schmid; Thomas Theiler; Ottmar Heudorfer; Karsten Weber; Conor Patrick O'carroll


Archive | 2004

Method for the Thermal Treatment of Disk-Shaped Substrates

Zsolt Nenyei; Steffen Frigge; Patrick Schmid; Thorsten Hulsmann; Thomas Theiler


Archive | 2005

Process chamber for heating rotating semiconductor wafers, for dosing, has a dividing wall giving part-chambers for the wafer and the rotating unit with prevention of particle deposition on the wafer

Helmut Aschner; Patrick Schmid; Thomas Theiler


Archive | 2005

Vorrichtung und Verfahren zur Reduktion von Partikeln bei der thermischen Behandlung rotierender Substrate

Helmut Aschner; Patrick Schmid; Thomas Theiler


Archive | 2013

Method for the thermal treatment of silicon carbide substrates

Franziska Rohlfing; Ralf Reize; Peter Benkart; Wilfried Lerch; Patrick Schmid

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