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Dive into the research topics where Scott Bushman is active.

Publication


Featured researches published by Scott Bushman.


Process, equipment, and materials control in integrated circuit manufacturing. Conference | 1999

Integration of the APC framework with AMD's Fab25 factory system

Scott Bushman; William Jarrett Campbell; Michael L. Miller

This paper discusses the integration and development of advanced process control technologies with AMDs Fab25 factory systems using the Advance Process Control Framework. The Framework is an open software architecture that allows the integration of existing factory systems, such as the manufacturing execution systems, configurable equipment interfaces, recipe management systems, metrology tools, process tools, and add-on sensors, into a system which provides advanced process control specific functionality. The Advanced Process Control Framework project was formulated to enable effective integration of Advanced Process Control applications into a semiconductor facility to improve manufacturing productivity and product yields. The main communication link between the factory system and the Framework is the Configurable Equipment Interface. It interfaces through a specialized component in the framework, the Machine Interface, which converts the factory system communication protocol, ISIS, to the Framework protocol, CORBA. The Framework is a distributed architecture that uses CORBA as a communication protocol between specialized components. A generalized example of how the Framework is integrated into the semiconductor facility is provided, as well as a description of the overall architecture used for process control strategy development. The main development language, Tcl/Tk, provides for increased development and deployment over traditional coding methods.


Archive | 2001

Method and apparatus for the integration of sensor data from a process tool in an advanced process control (APC) framework

Michael L. Miller; Scott Bushman


Archive | 1999

Method for adjusting incoming film thickness uniformity such that variations across the film after polishing minimized

Scott Bushman; William Jarrett Campbell


Archive | 2002

Method and apparatus for controlling a thickness of a copper film

Thomas J. Sonderman; Scott Bushman; Craig W. Christian


Archive | 2001

Run-to-run control method for automated control of metal deposition processes

Thomas J. Sonderman; Scott Bushman; Craig W. Christian


Archive | 2000

Method and apparatus for controlling wafer thickness uniformity in a multi-zone vertical furnace

William Jarrett Campbell; Scott Bushman; Thomas J. Sonderman; Coss Elfido


Archive | 2001

Method and apparatus for controlling focus based on a thickness of a layer of photoresist

Scott Bushman; Anastasia Oshelski Peterson; Edward C. Stewart; Curtis Warren Doss


Archive | 2000

Control of two-step gate etch process

Matthew A. Purdy; Scott Bushman; James H. Hussey; Douglas J. Bonser


Archive | 2001

Method and apparatus for controlling optical-parameters in a stepper

Scott Bushman; Anthony J. Toprac; Richard D. Edwards; Edward C. Stewart


Archive | 2002

Method of controlling the thickness of layers of photoresist

Scott Bushman; Curtis Warren Doss; Anthony J. Toprac

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