Seigou Yukutake
Hitachi
Network
Latest external collaboration on country level. Dive into details by clicking on the dots.
Publication
Featured researches published by Seigou Yukutake.
international symposium on power semiconductor devices and ic s | 2000
Yasuyuki Kojima; Minehiro Nemoto; Seigou Yukutake; Takayuki Iwasaki; M. Amishiro; Nobuyasu Kanekawa; Atsuo Watanabe; Yusuke Takeuchi; Noboru Akiyama
We have developed a multi-channel monolithic isolator IC that can provide 2.3 kVac isolation and 100 MHz signal transmission. This IC uses high voltage on-chip isolator technology using trench isolation with buried oxide on the SOI substrate and 0.4 /spl mu/m CMOS driver and receiver circuits. This technology enables to produce a 4-channel monolithic isolator with an area of 1.5 mm/sup 2/ and a consumption current of 0.5 mA per channel at a frequency of 50 MHz. We have also developed a one-chip modem interface IC that includes the multi-channel isolator and an analog front-end circuit.
international symposium on power semiconductor devices and ic's | 2009
Takayuki Hashimoto; Y. Yuyama; M. Amishiro; Minehiro Nemoto; Seigou Yukutake; Yasuyuki Kojima; Nobuyasu Kanekawa; Yusuke Takeuchi; A. Watanebe
We have developed a monolithic isolator that provides an isolation voltage of 4 kV and a signal transmission rate of 100 Mbps. Two circuit areas are isolated using 34 trenches on a bonded SOI with 3-µm-thick buried oxide. The inequality in the voltages applied to the trenches is reduced using polysilicon resistors parallel to the trenches, which increases the isolation voltage from 2.4 to 4.0 kV. The isolator consists of two series of high-voltage capacitors in which silicon on buried oxide and a third metal are used as electrodes. We have also developed a network interface LSI with 4-channel isolators, which provide 4-kV isolation and 100-Mbps transmission.
international symposium on power semiconductor devices and ic's | 2012
Naoki Sakurai; K. Takami; Seigou Yukutake; Y. Kouno; Junichi Sakano
A 4.5-kV voltage level-shift circuit with a multi-chip structure composed of upper and lower arm driver ICs and dedicated discrete IGBTs was developed. It was experimentally confirmed that this level-shift circuit could drive a 3.3-kV/1200-A IGBT module.
Archive | 1995
Shuji Ikeda; Satoshi Meguro; Soichiro Hashiba; Isamu Kuramoto; Atsuyoshi Koike; Katsuro Sasaki; Koichiro Ishibashi; Toshiaki Yamanaka; Naotaka Hashimoto; Nobuyuki Moriwaki; Shigeru Takahashi; Atsushi Hiraishi; Yutaka Kobayashi; Seigou Yukutake
Archive | 2006
Tatsumi Yamauchi; Hiroyuki Shoji; Seigou Yukutake; Toshikazu Okubo
Archive | 2005
Hiroyuki Shoji; Akihiko Kanouda; Ryuichi Saito; Seigou Yukutake; Katsuhiro Higuchi
Archive | 2003
Noboru Akiyama; Minehiro Nemoto; Seigou Yukutake; Yasuyuki Kojima; Kazuyuki Kamegaki
Archive | 1995
Shuji Ikeda; Satoshi Meguro; Soichiro Hashiba; Isamu Kuramoto; Atsuyoshi Koike; Katsuro Sasaki; Koichiro Ishibashi; Toshiaki Yamanaka; Naotaka Hashimoto; Nobuyuki Moriwaki; Shigeru Takahashi; Atsushi Hiraishi; Yutaka Kobayashi; Seigou Yukutake
Archive | 1990
Kyoichiro Asayama; Hiroyuki Miyazawa; Yutaka Kobayashi; Seigou Yukutake
Archive | 1997
Seigou Yukutake; Takashi Akioka; Kinya Mitsumoto; Takahiro Nagano; Hideo Maejima