Shigeo Ohshima

A 56-nm CMOS 99-

A single 3.3-V only, 8-Gb NAND flash memory with the smallest chip to date, 98.8 mm2, has been successfully developed. This is the worlds first integrated semiconductor chip fabricated with 56-nm CMOS technologies. The effective cell size including the select transistors is 0.0075 mum2 per bit, which is the smallest ever reported. To decrease the chip size, a very efficient floor plan with one-sided row decoder, one-sided page buffer, and one-sided pad is introduced. As a result, an excellent 70% cell area efficiency is realized. The program throughput is drastically improved to twice as large as previously reported and comparable to binary memories. The best ever 10-MB/s programming is realized by increasing the page size from 4kB to 8kB. In addition, noise cancellation circuits and the dual VDD-line scheme realize both a small die size and a fast programming. An external page copy achieves a fast 93-ms block copy, efficiently using a 1-MB block size

{\hbox {mm}}^{2}

A 512-kb*9 DRAM with a 500-Mbyte/s data transfer rate was developed. This high data rate was achieved by designing a DRAM core with a very high internal column bandwidth, and coupling this core with a block-oriented, small-swing, synchronous interface that uses skew-canceling clocks. The DRAM has a 1-kbyte*2-line sense-amp cache and is assembled in a 32-pin vertical surface-mount-type plastic package. The measurement results clearly verified the 500-Mbyte/s data rate. >

8-Gb Multi-Level NAND Flash Memory With 10-MB/s Program Throughput

Fabricated in 56nm CMOS technology, an 8Gb multi-level NAND Flash memory occupies 98.8mm2, with a memory cell size of 0.0075mum/b. The 10MB/s programming and 93ms block copy are also realized by introducing 8kB page, noise-cancellation circuits, external page copy and the dual VDD scheme enabling efficient use of 1MB blocks

A 500-megabyte/s data-rate 4.5 M DRAM

A novel 512-kb*9 DRAM with a 500-Mbyte/s data transfer rate has been designed. This high data-rate has been achieved by coupling a very high internal column bandwidth DRAM core with a very high internal column bandwidth, and coupling this core with a block oriented, small-swing, synchronous interface that uses skew canceling clocks. The DRAM has a 1-kbyte*2 line sense amplifier cache. This DRAM is assembled in a 32-pin vertical surface mount type plastic package.<<ETX>>

A 56nm CMOS 99mm2 8Gb Multi-level NAND Flash Memory with 10MB/s Program Throughput

NAND flash memory use in digital still cameras and cellular phones is driving demand for larger-capacity storage. Moreover, NAND flash has the potential to replace HDDs. To achieve larger capacity while maintaining low cost per bit, technical improvements in feature size and area reduction are essential. To meet the stringent requirements, we develop a 16 Gb 4-level NAND flash memory in 43 nm CMOS technology. In 43 nm generation, gate-induced drain leakage (GIDL) influences the electrical field on both sides of NAND strings. GIDL causes severe program disturb problems to NAND flash memories. To avoid GIDL, two dummy wordlines (WL) on both sides of NAND strings are added. This is effective because the dummy gate voltages, are selected independent of the program inhibit voltage.

500 Mbyte/sec data-rate 512 Kbits*9 DRAM using a novel I/O interface

NAND flash memories are used in digital still cameras, cellular phones, MP3 players and various memory cards. As seen in the growing needs for applications such as solid-state drives and video camcoders, the market demands for larger-capacity storage has continuously increased and NAND Flash memories are enabling a wide range of new applications. In such situations, to achieve larger capacity at low cost per bit, technical improvement in feature-size scaling [1], multi-bit per cell [2,3] and area reduction are essential.

A 120mm 2 16Gb 4-MLC NAND Flash Memory with 43nm CMOS Technology

Multi-level programming is demonstrated with 43 nm-node NAND floating-gate megabit cells for the first time, by thinning an inter-gate dielectric film to less than 13 nm. 43 nm-node cobalt-silicide control-gate and copper bit-line technologies are developed to achieve low resistances of the word lines and bit lines.