Shuji Asai
NEC
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The Japan Society of Applied Physics | 1986
Shuji Asai; Norio Goto; M. Kanamori; Yuji Tanaka; Takashi Furutsuka
I . INTRODUCTION In order to achieve ultrahigh-speed pedormance in GaAs LSIs, it is quite important to make a further improvement in the load drivability of the basic togic gates and, hence, to increase the transconductance (g-) of GaAs MESFETs. To this end, many MESFET technologies have been developed demonstrating their potentialities, such as SAINTI), refractory metal gate n* self-alignment technology2), Pt buried gate layer technologyS), and closely-spaced electrode technology4).
ieee gallium arsenide integrated circuit symposium | 1997
Nobuhide Yoshida; Masahiro Fujii; Takao Atsumo; Keiichi Numata; Shuji Asai; MMichihisa Kohno; Hirokazu Oikawa; Hiroaki Tsutsui; Tadashi Maeda
An ECL-compatible 10-Gbps GaAs 8:1 multiplexer (MUX) and 1:8 demultiplexer (DEMUX) has been developed. To decrease power consumption and to maximize phase margin, the clock-generating circuit employs source-coupled FET logic (SCFL) circuits. Also, cascade-connected source-follower circuits are used in the clock buffer. These circuits can reduce the power consumption when the fan-out number is large. Direct coupled FET logic (DCFL) circuits are employed for the 2:1 MUX/1:2 DEMUX circuits operating below 5 Gbps. The ICs, which are mounted on ceramic packages, operate at up to 10 Gbps with a power consumption of 1.2 W for the MUX and 1.0 W for the DEMUX at ECL-compatible supply voltages. These power-consumption values are one-third of the previously reported values.
10th Annual IEEE (GaAs IC) Symposium, Gallium Arsenide Integrated Circuit. Technical Digest 1988. | 1988
Tadashi Maeda; Y. Miyatake; Y. Tomonoh; Shuji Asai; Masaoki Ishikawa; K. Nakaizumi; Yasuo Ohno; N. Ohno; Takashi Furutsuka
A GaAs buffering circuit LSI for ultra-fast data processing systems has been developed. The LSI with CML compatible interface and +1.5/-3.3-V power supply voltage has successfully achieved 2-ns data cycle time with 4.8-W chip power dissipation. The circuit was designed to accommodate the basic variations in FET parameters over the operating temperature range. Refractory metal gate lightly-doped drain (LDD) MESFET technology was employed. The gate length is 1.0 mu m. WSi-W bilayer metallization system was used to reduce the gate resistance.<<ETX>>
Archive | 1995
Shuji Asai; Michihisa Kohno
The Japan Society of Applied Physics | 1983
A. Higashisaka; Masaoki Ishikawa; Fumiaki Katano; Shuji Asai; Takashi Furutsuka; Yoichiro Takayama
Archive | 1998
Shuji Asai; Hirokazu Oikawa
Archive | 1996
Shuji Asai
Archive | 1997
Shuji Asai
Solid-state Electronics | 1998
Naoki Furuhata; Masahiro Fujii; Shuji Asai; Tadashi Maeda; Yasuo Ohno
IEICE Transactions on Electronics | 2000
Tadayoshi Enomoto; Atsunori Hirobe; Masahiro Fujii; Nobuhide Yoshida; Shuji Asai