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The Japan Society of Applied Physics | 1986

A High Performance LDD GaAs MESFET with a Refractory Metal Gate

Shuji Asai; Norio Goto; M. Kanamori; Yuji Tanaka; Takashi Furutsuka

I . INTRODUCTION In order to achieve ultrahigh-speed pedormance in GaAs LSIs, it is quite important to make a further improvement in the load drivability of the basic togic gates and, hence, to increase the transconductance (g-) of GaAs MESFETs. To this end, many MESFET technologies have been developed demonstrating their potentialities, such as SAINTI), refractory metal gate n* self-alignment technology2), Pt buried gate layer technologyS), and closely-spaced electrode technology4).


ieee gallium arsenide integrated circuit symposium | 1997

Low-power-consumption 10-Gbps GaAs 8:1 multiplexer/1:8 demultiplexer

Nobuhide Yoshida; Masahiro Fujii; Takao Atsumo; Keiichi Numata; Shuji Asai; MMichihisa Kohno; Hirokazu Oikawa; Hiroaki Tsutsui; Tadashi Maeda

An ECL-compatible 10-Gbps GaAs 8:1 multiplexer (MUX) and 1:8 demultiplexer (DEMUX) has been developed. To decrease power consumption and to maximize phase margin, the clock-generating circuit employs source-coupled FET logic (SCFL) circuits. Also, cascade-connected source-follower circuits are used in the clock buffer. These circuits can reduce the power consumption when the fan-out number is large. Direct coupled FET logic (DCFL) circuits are employed for the 2:1 MUX/1:2 DEMUX circuits operating below 5 Gbps. The ICs, which are mounted on ceramic packages, operate at up to 10 Gbps with a power consumption of 1.2 W for the MUX and 1.0 W for the DEMUX at ECL-compatible supply voltages. These power-consumption values are one-third of the previously reported values.


10th Annual IEEE (GaAs IC) Symposium, Gallium Arsenide Integrated Circuit. Technical Digest 1988. | 1988

A GaAs buffering circuit LSI for ultra-fast data processing systems

Tadashi Maeda; Y. Miyatake; Y. Tomonoh; Shuji Asai; Masaoki Ishikawa; K. Nakaizumi; Yasuo Ohno; N. Ohno; Takashi Furutsuka

A GaAs buffering circuit LSI for ultra-fast data processing systems has been developed. The LSI with CML compatible interface and +1.5/-3.3-V power supply voltage has successfully achieved 2-ns data cycle time with 4.8-W chip power dissipation. The circuit was designed to accommodate the basic variations in FET parameters over the operating temperature range. Refractory metal gate lightly-doped drain (LDD) MESFET technology was employed. The gate length is 1.0 mu m. WSi-W bilayer metallization system was used to reduce the gate resistance.<<ETX>>


Archive | 1995

Fabrication process for compound semiconductor device

Shuji Asai; Michihisa Kohno


The Japan Society of Applied Physics | 1983

Sidewall-Assisted Closely Spaced Electrode Technology for High Speed GaAs LSIs

A. Higashisaka; Masaoki Ishikawa; Fumiaki Katano; Shuji Asai; Takashi Furutsuka; Yoichiro Takayama


Archive | 1998

Method of manufacturing a field effect transistor

Shuji Asai; Hirokazu Oikawa


Archive | 1996

Substrate with a compound semiconductor surface layer and method for preparing the same

Shuji Asai


Archive | 1997

Compound semiconductor device having an ion implanted defect-rich layer for improved backgate effect suppression

Shuji Asai


Solid-state Electronics | 1998

Performance of a p-channel heterojunction fet with p+-GaAs selectively grown contact layers for GaAs complementary ICs

Naoki Furuhata; Masahiro Fujii; Shuji Asai; Tadashi Maeda; Yasuo Ohno


IEICE Transactions on Electronics | 2000

Low-Voltage, Low-Power, High-Speed 0.25-mum GaAs HEMT Delay Flip-Flops

Tadayoshi Enomoto; Atsunori Hirobe; Masahiro Fujii; Nobuhide Yoshida; Shuji Asai

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