Stephen L. Brown

Exchange-biased magnetic tunnel junctions and application to nonvolatile magnetic random access memory (invited)

Exchange biased magnetic tunnel junction (MTJ) structures are shown to have useful properties for forming magnetic memory storage elements in a novel cross-point architecture. MTJ elements have been developed which exhibit very large magnetoresistive (MR) values exceeding 40% at room temperature, with specific resistance values ranging down to as little as ∼60 Ω(μm)2, and with MR values enhanced by moderate thermal treatments. Large MR values are observed in magnetic elements with areas as small as 0.17 (μm)2. The magnetic field dependent current–voltage characteristics of an MTJ element integrated with a silicon diode are analyzed to extract the MR properties of the MTJ element itself.

Band-Edge High-Performance High-k/Metal Gate n-MOSFETs Using Cap Layers Containing Group IIA and IIIB Elements with Gate-First Processing for 45 nm and Beyond

We have fabricated electrically reliable band-edge (BE) high-k/metal nMOSFETs stable to 1000degC, that exhibit the highest mobility (203 cm2/Vs @ 1MV/cm) at the thinnest Tinv (1.4 nm) reported to date. These stacks are formed by capping HfO2 with ultra-thin layers containing strongly electropositive gp. IIA and IIIB elements (e.g. Mg and La), prior to deposition of the TiN/Poly-Si electrode stack, in a conventional gate-first flow. Increasing the cap thickness tunes the Vt/V fb from a midgap position to BE while maintaining high mobility and good PBTI. The addition of La can enhance the effective k value of the dielectric stack, resulting in EOTs < 1nm. Short channel devices with band edge characteristics are demonstrated down to 60 nm. Finally, possible mechanisms to explain the nFET Vt shift are discussed

A three-terminal spin-torque-driven magnetic switch

A three-terminal spin-torque-driven magnetic switch is experimentally demonstrated. The device uses nonlocal spin current and spin accumulation as the main mechanism for current-driven magnetic switching. It separates the current-induced write operation from that of a magnetic tunnel junction based read. The write current only passes through metallic structures, improving device reliability. The device structure makes efficient use of lithography capabilities, important for robust process integration.

Understanding mobility mechanisms in extremely scaled HfO 2 (EOT 0.42 nm) using remote interfacial layer scavenging technique and V t -tuning dipoles with gate-first process

We demonstrate a novel “remote interfacial layer (IL) scavenging” technique yielding a record-setting equivalent oxide thickness (EOT) of 0.42 nm using a HfO2-based MOSFET high-к gate dielectric. Intrinsic effects of IL scaling on carrier mobility are clarified using this method. We reveal that the mobility degradation observed for La-containing high-к is not due to the La dipole but due to the intrinsic IL scaling effect, whereas an Al dipole brings about additional mobility degradation. This unique nature of the La dipole enables aggressive EOT scaling in conjunction with IL scaling for the 16 nm technology node without extrinsic mobility degradation.

Engineering High Dielectric Constant Materials for Band-Edge CMOS Applications

This paper summarizes studies performed using capping layers in conjunction with high-K dielectrics to obtain band-edge CMOS devices. MgO and Al2O3 cap layers are evaluated for nFET and pFET devices respectively. By precisely positioning the cap materials in the gate stack and evaluating their effect as a function of process temperature and capping layer thickness, a deeper understanding of the mechanism of threshold voltage shift caused by the capping layers is obtained. MgO is observed to readily diffuse into the HfO2 stack at temperatures as low as 600 oC while Al2O3 diffuses through HfO2 at higher temperatures of 1000 oC. MgO caps located below the HfO2 and processed at 600 oC provide the best scaling and maximum voltage shift, while a trade-off between scaling and voltage shift has to be made when using Al2O3 caps.

High-bias backhopping in nanosecond time-domain spin-torque switches of MgO-based magnetic tunnel junctions

For CoFeB∕MgO-based magnetic tunnel junctions, the switching probability has an unusual dependence on bias voltage V and bias magnetic field H for bias voltage pulse durations t long enough to allow thermally activated reversal. At high junction bias close to 1V, the probability of magnetic switching in spin-torque-driven switches sometimes appears to decrease. This is shown to be due to a backhopping behavior occurring at high bias, and it is asymmetric in bias voltage, being more pronounced in the bias direction for antiparallel-to-parallel spin-torque switch, i.e., in the direction of electrons tunneling into the free layer. This asymmetry hints at processes involving hot electrons within the free-layer nanomagnet.

Switching distributions and write reliability of perpendicular spin torque MRAM

We report data from 4-kbit spin torque MRAM arrays using tunnel junctions (TJs) with magnetization perpendicular to the wafer plane. We show for the first time the switching distribution of perpendicular spin torque junctions. The percentage switching voltage width, σ(Vc)/&#60;Vc> = 4.4%, is sufficient to yield a 64 Mb chip. Furthermore we report switching probability curves down to error probabilities of 5×10−9 per pulse which do not show the anomalous switching seen in previous studies of in-plane magnetized bits.

Integrated on-chip inductors with electroplated magnetic yokes (invited)

Thin-film ferromagnetic inductors show great potential as the energy storage element for integrated circuits containing on-chip power management. In order to achieve the high energy storage required for power management, on-chip inductors require relatively thick magnetic yoke materials (several microns or more), which can be readily deposited by electroplating through a photoresist mask as demonstrated in this paper, the yoke material of choice being Ni45Fe55, whose properties of relatively high moment and electrical resistivity make it an attractive model yoke material for inductors. Inductors were designed with a variety of yoke geometries, and included both single-turn and multi-turn coil designs, which were fabricated on 200 mm silicon wafers in a CMOS back-end-of-line (BEOL) facility. Each inductor consisted of electroplated copper coils enclosed by the electroplated Ni45Fe55 yokes; aspects of the fabrication of the inductors are discussed. Magnetic properties of the electroplated yoke materials are...

Magnetic field-induced noise in directly coupled high Tc superconducting quantum interference device magnetometers

We have measured the noise of several directly coupled high Tc superconducting quantum interference device (SQUID) magnetometers as we change a static magnetic field B while the devices are superconducting. Devices without “flux dams” show an increase in noise at relatively low magnetic fields B∼1 μT. Devices with flux dams can show no deterioration of the noise characteristics for B as large as 34 μT. The flux dams are part of the pickup loop and limit the circulating current Icirc. If Icirc is kept sufficiently low no vortices are forced into the SQUID loop and the noise performance of the magnetometer remains good.

Observation of magnetic switching in submicron magnetic-tunnel junctions at low frequency

Understanding the magnetic switching behavior in micron and submicron scale specimens is important for a number of applications. In this study, magnetic-tunnel junctions of various sizes and shapes were fabricated and their switching behavior was studied in detail. Using exchange bias to offset the magnetic response of one electrode, the response of the other (free) electrode was determined from measurements of junction resistance. Switching threshold curves were measured by sweeping magnetic fields in both easy and hard direction. Single domain like switching was observed in some of our smallest submicron junctions. The observed behavior was compared with predictions from the Stoner–Wohlfarth rotational model and from numerical calculations.