Is this you? Create Your Porfile
Avatar

Thomas J. Haigh

IBM

Network

Latest external collaboration on country level. Dive into details by clicking on the dots.

Explore More

Hotspot

Dive into the research topics where Thomas J. Haigh is active.

Explore More

Publication

Featured researches published by Thomas J. Haigh.

Meeting Abstracts | 2012

Robust Ultrathin (20-25 nm)Trilayer Dielectric Low k Cu Damascene Cap for Sub-30 nm Nanoelectric Devices

Son Van Nguyen; Thomas J. Haigh; M. Tagami; Alfred Grill; S. Cohen; Hosadurga Shobha; Chao-Kun Hu; Edward E. Adams; E. Liniger; Thomas M. Shaw; Tien Cheng; Hakeem Yusuff; Yiheng Xu; Tze-Man Ko; Steven E. Molis; Terry A. Spooner; Spyridon Skordas; Xiao Hu Liu; Griselda Bonilla; Daniel C. Edelstein

Robust ultrathin (20 nm) trilayer low k SiNx/SiNy/SiCNH dielectric Cu caps (k ~4.0-4.2) with post ultraviolet (UV) cure compressive stress were developed and integrated into 22nm CMOS Back End Of Line (BEOL) devices. The new cap reduces device’s capacitance (~ 4 %) and enhances stress stability in Cu-Ultra low k structures.

Archive | 2012

SELF-ALIGNED COMPOSITE M-MOx/DIELECTRIC CAP FOR Cu INTERCONNECT STRUCTURES

Son Van Nguyen; Alfred Grill; Thomas J. Haigh; Hosadurga Shobha; Tuan A. Vo

Archive | 2013

C-rich carbon boron nitride dielectric films for use in electronic devices

Son Van Nguyen; Alfred Grill; Thomas J. Haigh; Sanjay Mehta

Archive | 2009

Engineered interconnect dielectric caps having compressive stress and interconnect structures containing same

S. Cohen; Alfred Grill; Thomas J. Haigh; Xiao H. Liu; Son Van Nguyen; Thomas M. Shaw; Hosadurga Shobha

Archive | 2013

MULTIPHASE ULTRA LOW K DIELECTRIC MATERIAL

Alfred Grill; Thomas J. Haigh; Kelly Malone; Son Van Nguyen; Vishnubhai Vitthalbhai Patel; Hosadurga Shobha

Archive | 2013

MULTILAYERED LOW k CAP WITH CONFORMAL GAP FILL AND UV STABLE COMPRESSIVE STRESS PROPERTIES

Mihaela Balseanu; S. Cohen; Alfred Grill; Thomas J. Haigh; Son Van Nguyen; Li-Qun Xia

Archive | 2014

Interlevel Dielectric Stack for Interconnect Structures

Griselda Bonilla; Alfred Grill; Thomas J. Haigh; Satyanarayana V. Nitta; Son Van Nguyen

ECS Journal of Solid State Science and Technology | 2017

Low Hydrogen Silicon Carbon Nitride Cap for High Performance Sub-10 nm Cu-Low k Interconnect

Son Van Nguyen; Shobha Hosadugra; Thomas J. Haigh; Yongjin Yao; Leo Tai; S. Cohen; Thomas M. Shaw; Chao-Kun Hu; E. Liniger; Kumar Virwani; A. J. Kellock; Donald F. Canaperi

Archive | 2012

MODULATED COMPOSITIONAL AND STRESS CONTROLLED MULTILAYER ULTRATHIN CONFORMAL SiNx DIELECTRICS USED IN NANO DEVICE FABRICATION

Mihaela Balseanu; S. Cohen; Alfred Grill; Thomas J. Haigh; Son Van Nguyen; Mei-Yee Shek; Hosadurga Shobha; Li-Qun Xia

ECS Transactions | 2017

BEOL Dielectric Processing for Cu-Low k Nano Interconnect- Impact of Plasma CVD Initial Transient Phenomena (ITP)

Son Van Nguyen; Hosadurga Shobha; Thomas J. Haigh; Deepika Priyadarshini; Donald F. Canaperi

Explore More

Collaboration

Dive into the Thomas J. Haigh's collaboration.

Top Co-Authors
Avatar

Son Van Nguyen

IBM

View shared research outputs
Top Co-Authors
Avatar

Alfred Grill

IBM

View shared research outputs
Top Co-Authors
Avatar

Hosadurga Shobha

IBM

View shared research outputs
Top Co-Authors
Avatar

S. Cohen

IBM

View shared research outputs
Top Co-Authors
Avatar

Donald F. Canaperi

IBM

View shared research outputs
Top Co-Authors
Avatar

Thomas M. Shaw

IBM

View shared research outputs
Top Co-Authors
Avatar

Deepika Priyadarshini

IBM

View shared research outputs
Top Co-Authors
Avatar

E. Liniger

IBM

View shared research outputs
Top Co-Authors
Avatar

Sanjay Mehta

IBM

View shared research outputs
Top Co-Authors
Avatar

Griselda Bonilla

IBM

View shared research outputs
Explore More
Researchain Logo
Decentralizing Knowledge