Tin H. Lai

A 3.3-V programmable logic device that addresses low power supply and interface trends

This paper discusses a 3.3 V programmable logic device family which provides up to 130 Kgates. It blends a multi-dimensional interconnect scheme, logic array block approach consisting of 6,656 logic elements and circuit techniques to address low power supply and interface trends. It is designed on a 0.35 /spl mu/m triple metal-dual oxide process to operate in a 3.3 V only, 5 V only or 3.3 V-5 V systems. Under worst case operating conditions it was observed to have a typical system operating frequency of 90 MHz. The EPF10K50V is the first member of the second-generation FLEX 10K family.

Architecture and methodology of a SoPC with 3.25Gbps CDR based SERDES and 1Gbps dynamic phase alignment

The SoPC (system on a programmable chip) aspects of the Stratix GX/spl trade/ FPGA with 3.125 Gbps SERDES are described. The FPGA was fabricated on a 0.13 /spl mu/m, 9-layer metal process. The 16 high-speed serial transceiver channels with clock data recovery (CDR) provides 622-Megabits per second (Mbps) to 3.125-Gbps full-duplex transceiver operation per channel. Another challenge described is the implementation of 39 source-synchronous channels at 100 Mbps to 1 Gbps, utilizing dynamic phase alignment (DPA). The implementation and integration of the FPGA logic array (with its own hard IP) with the CDR and DPA channels involved grappling with SoC design issues and methodologies.