Patrick W. Tandy

Package stack via bottom leaded plastic (BLP) packaging

Assembling a stacked die package

Controlling packaging encapsulant leakage

Method for fabricating semiconductor packages using mold tooling fixture with flash control cavities

Microelectronic devices, methods of operating microelectronic devices, and methods of providing microelectronic devices

Semiconductor package with molded flash

Compression layer on the lead frame to reduce stress defects

Mold assembly for a package stack via bottom-leaded plastic (BLP) packaging

Apparatus and method for marking defective sections of laminate substrates

Compression layer on the leadframe to reduce stress defects