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Toshihiko Takakura

Hitachi

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Publication

Featured researches published by Toshihiko Takakura.

Archive | 1985

Method of forming extrinsic base by diffusion from polysilicon/silicide source and emitter by lithography

Yoichi Tamaki; Kazuhiko Sagara; Norio Hasegawa; Shinji Okazaki; Toshihiko Takakura; Hirotaka Nishizawa

Archive | 1986

Isolation regions formed by locos followed with groove etch and refill

Akihisa Uchida; Daisuke Okada; Toshihiko Takakura; Katsumi Ogiue; Yoichi Tamaki; Masao Kawamura

Archive | 1988

Process of manufacturing semiconductor integrated circuit device and product formed thereby

Mikinori Kawaji; Toshihiko Takakura; Akihisa Uchida; Shigeo Kuroda; Yoichi Tamaki; Takeo Shiba; Kazuhiko Sagara; Masao Kawamura

Archive | 1987

Semiconductor IC with dual groove isolation

Mikinori Kawaji; Toshihiko Takakura; Akihisa Uchida; Shigeo Kuroda; Yoichi Tamaki; Takeo Shiba; Kazuhiko Sagara; Masao Kawamura

Archive | 1987

Semiconductor body, and device formed therefrom, having grooves with silicon nitride on the groove surfaces

Daisuke Okada; Akihisa Uchida; Toshihiko Takakura; Shinji Nakashima; Nobuhiko Ohno; Katsumi Ogiue

Archive | 1991

PROCESS OF MANUFACTURING SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE HAVING TRENCH AND FIELD ISOLATION REGIONS

Mikinori Kawaji; Toshihiko Takakura; Akihisa Uchida; Shigeo Kuroda; Yoichi Tamaki; Takeo Shiba; Kazuhiko Sagara; Masao Kawamura

Archive | 1991

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE WITH CONSTANT WIDTH DEEP GROOVE ISOLATION

Akihisa Uchida; Daisuke Okada; Toshihiko Takakura; Katsumi Ogiue; Yoichi Tamaki; Masao Kawamura

Archive | 1989

Method for fabricating a semiconductor integrated circuit device having thick oxide films and groove etch and refill

Akihisa Uchida; Daisuke Okada; Toshihiko Takakura; Katsumi Ogiue; Yoichi Tamaki; Masao Kawamura

Archive | 1984

Method of forming trench isolation in an integrated circuit

Daisuke Okada; Akihisa Uchida; Toshihiko Takakura; Shinji Nakashima; Nobuhiko Ohno; Katsumi Ogiue

Archive | 1989

Method of fabricating a semiconductor substrate, and semiconductor device, having thick oxide films and groove isolation

Akihisa Uchida; Daisuke Okaka; Toshihiko Takakura; Katsumi Ogiue; Yoichi Tamaki; Masao Kawamura

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Yoichi Tamaki

Hitachi

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Akihisa Uchida

Hitachi

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Katsumi Ogiue

Hitachi

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Daisuke Okada

Hitachi

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Masao Kawamura

Hitachi

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Kazuhiko Sagara

Hitachi

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Hirotaka Nishizawa

Hitachi

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Norio Hasegawa

Hitachi

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Shinji Okazaki

Hitachi

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Nobuhiko Ohno

Hitachi

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