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Weng Hong Teh

Intel

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Publication

Featured researches published by Weng Hong Teh.

Archive | 2011

Secondary device integration into coreless microelectronic device packages

Weng Hong Teh; John S. Guzek

Archive | 2013

SEMICONDUCTOR PACKAGE WITH MECHANICAL FUSE

Weng Hong Teh; Kevin L. Lin; Feras Eid; Qing Ma

Archive | 2015

Bumpless build-up layer package including an integrated heat spreader

Weng Hong Teh; Deepak V. Kulkarni; Chia-Pin Chiu; Tannaz Harirchian; John S. Guzek

Archive | 2011

MULTI DIE PACKAGE STRUCTURES

Weng Hong Teh; John S. Guzek; Shan Zhong

Archive | 2013

Bumpless Build-Up-Layer-Paket einschliesslich eines integrierten Wärmeverteilers

Weng Hong Teh; Deepak V. Kulkarni; Chia-Pin Chiu; Tannaz Harirchian; John S. Guzek

Archive | 2011

PACKAGED SEMICONDUCTOR DIE WITH BUMPLESS DIE-PACKAGE INTERFACE FOR BUMPLESS BUILD-UP LAYER (BBUL) PACKAGES

Pramod Malatkar; Weng Hong Teh; John S. Guzek; Robert L. Sankman

Archive | 2013

DEVICE, SYSTEM AND METHOD FOR PROVIDING MEMS STRUCTURES OF A SEMICONDUCTOR PACKAGE

Weng Hong Teh; Tarek A Ibrahim; Sarah K. Haney; Daniel N Sobieski; Parshuram B Zantye; Chad E Mair; Telesphor Kamgaing

Archive | 2013

BUMPLESS DIE-PACKAGE INTERFACE FOR BUMPLESS BUILD-UP LAYER (BBUL)

Weng Hong Teh; John S. Guzek; Robert L. Sankman

Archive | 2013

Hermetic encapsulation for microelectromechanical systems (mems) devices

Sarah Haney; Weng Hong Teh; Feras Eid; Sasha N. Oster

Archive | 2013

Halbleitergehäuse mit mechanischer Sicherung Semiconductor packages with mechanical securing

Feras Eid; Qing Ma; Weng Hong Teh; Kevin L. Lin

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Collaboration

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John S. Guzek

Intel

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Feras Eid

Intel

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Qing Ma

Intel

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Kevin L. Lin

Intel

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Chia-Pin Chiu

Intel

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Deepak V. Kulkarni

Intel

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Johanna M. Swan

Intel

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Tannaz Harirchian

Intel

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Robert L. Sankman

Intel

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Valluri Rao

Intel

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