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Dive into the research topics where Wolfgang Bergner is active.

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Featured researches published by Wolfgang Bergner.


Archive | 2000

Single sided buried strap

Ramachandra Divakaruni; Jack A. Mandelman; Wolfgang Bergner; Gary B. Bronner; Ulrike Gruening; Stephan Kudelka; Alexander Michaelis; Larry Alan Nesbit; Carl J. Radens; Till Schloesser; Helmut Tews


Archive | 2000

Structure and method for forming a body contact for vertical transistor cells

Ulrike Gruening; Helmut Klose; Wolfgang Bergner


Archive | 2000

Semiconductor fuses and antifuses in vertical DRAMS

Carl J. Radens; Wolfgang Bergner; Rama Divakaruni; Larry Alan Nesbit


Archive | 1998

Methods for protecting device components from chemical mechanical polish induced defects

Max G. Levy; Wolfgang Bergner; Bernhard Fiegl; George Richard Goth; Paul C. Parries; Matthew Sendelbach; Tinghao T. Wang; William C. Wille; Juergen Wittmann


Archive | 2003

Self-aligned buried strap process using doped HDP oxide

Jochen Beintner; Wolfgang Bergner; Richard A. Conti; Andreas Knorr; Rolf Weis


Archive | 2003

Process to suppress lithography at a wafer edge

Wolfgang Bergner; Linda A. Chen; Stephan Kudelka; Franz X. Zach


Archive | 2001

Structure and method of forming bitline contacts for a vertical DRAM array using a line bitline contact mask

Larry Alan Nesbit; Johnathan E. Faltermeier; Ramachandra Divakaruni; Wolfgang Bergner


Archive | 2001

Method of producing trench capacitor buried strap

Ramachandra Divakaruni; Jack A. Mandelman; Wolfgang Bergner; Gary B. Bronner; Ulrike Gruening; Stephen Kudelka; Alexander Michaelis; Larry Alan Nesbit; Carl J. Radens; Till Schloesser; Heomut Horst Tews


Archive | 2004

Verfahren zum Ausbilden eines selbstjustierenden Buried-Strap-Kontakts unter Verwendung von dotiertem HDP-Oxid

Wolfgang Bergner; Jochen Beintner; Richard A. Conti; Andreas Knorr; Rolf Weis


Archive | 2004

Verfahren zum Unterdrücken eines Lithographievorgangs am Rand einer Halbleiterscheibe A method of suppressing a lithography process at the edge of a semiconductor wafer

Wolfgang Bergner; Xiaochun Linda Chen; Stephan Kudelka; Franz X. Zach

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