Yoshihisa Nagano

A 256 kb nonvolatile ferroelectric memory at 3 V and 100 ns

One of the most important features for ferroelectric material is fast write at low voltage. This feature is used in a 256 kb nonvolatile memory that operates at 3 V power supply with a read/write time of 100 ns. Active current is 3 mA at 200 ns cycle time at 3 V for battery operation. The cell consists of 1 transistor and 1 capacitor per bit (1T1C) permitting a high level of integration. For low-voltage low-power operation, use is made of a preset reference-cell circuit, wordline boost circuits with a ferroelectric boosting capacitor and a divided-cell plate circuit.<<ETX>>

Integration technology of ferroelectrics and the performance of the integrated ferroelectrics

Abstract We have successfully incorporated the ferroelectric and the high dielectric constant capacitors into integrated circuits. The GaAs MMICs with BST capacitors have been widely used for cellular phones. The BST technology is also applied to a silicon CCD delayline processor for VCRs and camcorders. With respect to the ferroelectric technology with Y1, an experimentally fabricated 256k bit FeRAM has exhibited the remarkable performance of the 100 ns and 3V operation with a 1T/1C cell configuration dedicated for the FeRAM. These integrated ferroelectrics have been achieved by controlling the ferroelectric properties in thin films and incorporating the films into GaAs and silicon devices with outstanding process technology. Furthermore, we refer to the memory cell design technology which enables the FeRAM to work below 1V. Various advantages of low-voltage and high-speed operation inherent in integrated ferroelectrics will be emphasized on the intelligent microelectronics applications toward the next m...

Highly-reliable ferroelectric memory technology with bismuth-layer structured thin films (Y-1 family)

A highly-reliable ferroelectric memory (FeRAM) which ensures retention of data written at a low voltage of 2.5 V and humidity resistance for 10 years under a high temperature of 70/spl deg/C has been successfully developed for the first time. These excellent characteristics have been attained by a newly developed ferroelectric material with mixed superlattice crystal of Y-1 family and a integration technology which makes the use of pl-SiN passivation possible.

Advanced LSI embedded with FeRAM for contactless IC cards and its manufacturing technology

Abstract High performance LSIs embedded with ferroelectric random access memory (FeRAM) for contactless IC cards are now commercially available. The emphasis is placed on the materials solution with SrBi2(Ta,Nb)2O9 (SBTN) which enables to exploit the potential performance of FeRAMs for composite logic/microcontroller LSIs operating at high speeds and low powers. The leading-edge 0.6-μm and double-level-metal FeRAM technology produces microcontroller-embedded LSIs with 14-kbit or 64-kbit FeRAM. A mature 0.8-μm and single-level-metal process has been built to maximize the die yield. Yields exceeding 90% indicate the excellent process stability. Product qualification data have proven the robust FeRAM technologies.