Yuki Fujimura

A process-variation-tolerant dual-power-supply SRAM with 0.179µm 2 Cell in 40nm CMOS using level-programmable wordline driver

A 512Kb dual-power-supply SRAM is fabricated in 40nm CMOS with 0.179µm2 cell, which is 10% smaller than the SRAM scaling trend. The smaller cell size is realized by channel area saving. To improve the cell stability of the small channel area cell, we use a WL level-control scheme generated from dual power supplies in the WL driver. An adaptive WL-level programming scheme and dynamic-array-supply control increase SRAM operating margin. As a result, the cell failure rate is improved more than three orders of magnitude compared to the conventional dual-power-supply SRAM.

A 0.7 V Single-Supply SRAM With 0.495

We proposed a novel SRAM architecture with a high-density cell in low-supply-voltage operation. A self-write-back sense amplifier realizes cell failure rate improvement by more than two orders of magnitude at 0.6 V. A cascaded bit line scheme saves additional process cost for hierarchical bit line layer. A test chip with 256 kb SRAM utilizing 0.495 mum2 cell in 65 nm CMOS technology demonstrated 0.7 V single-supply operation.

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A single-power supply 64 kB SRAM is fabricated in a 45 nm bulk CMOS technology. The SRAM operates at 1GHz with a 0.7 V supply using a fine-grained bitline segmentation architecture and with an asymmetrical unit-ratio 6T cell. With the asymmetrical cell, 22% cell area has been saved compared to a conventional symmetrical cell. This bulk SRAM is designed for GHz-class sub-lV operation.

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This paper presents a configurable SRAM for low-voltage operation with constant-negative-level write buffer (CNL-WB) and level programmable wordline driver for single supply (LPWD-SS) operation. CNL-WB is suitable for compilable SRAMs and it improves write margin by featuring an automatic BL-level adjustment for configuration range of four to 512 cells/BL using a replica-BL technique. LPWD-SS optimizes the tradeoff between disturb and write margin of a memory cell, allowing a 60% shorter WL rise time than that of the conventional design [1] at 0.7V. A test-chip is fabricated in a 32nm high-k metal-gate CMOS technology with a 0.149µm2 6T-SRAM cell. Measurement results demonstrate a cell-failure rate improvement of two orders of magnitude for an array-configuration range of 64 to 256 rows by 64 to 256 columns.

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A digitized replica bitline delay technique has been proposed for random-variation-tolerant timing generation of SRAM sense amplifiers. The sense timing variation attributable to the random variation of transistor threshold voltage is reduced by sufficient count of multiple replica cells, and replica bitline delay is digitized and multiplied for adjusting it to the target sense timing. The variation of the generated timing was 34% smaller than that with a conventional technique and cycle time was reduced by 16% at the supply voltage of 0.6V in 40nm CMOS technology with this scheme.

Cell in 65 nm Technology Utilizing Self-Write-Back Sense Amplifier and Cascaded Bit Line Scheme

A low power SRAM operating at the logic supply voltage of 0.5V-1.0V without chip by chip trimming has been developed. A Dynamic Cell Stability Monitor controls wordline level adaptively by sensing the data flip in reference memory cells. The cell failure rate in every process corner is improved. A Modulated Wordline Level Scheme for Replica Cell optimizes sense timing and the operating frequency is improved by 18% at 1.0V. A Multiple Memory Cell Access Mode pushes the minimum operating cell supply voltage down to 0.5V. A 40nm 2Mb SRAM test chip with 0.24um2 cell has demonstrated 0.5V operation.

A Single-Power-Supply 0.7V 1GHz 45nm SRAM with An Asymmetrical Unit-ß-ratio Memory Cell

A digitized replica bitline delay technique has been proposed for random-variation-tolerant timing generation of SRAM sense amplifiers. The sense timing variation attributable to the random variation of transistor threshold voltage is reduced by sufficient count of multiple replica cells, and replica bitline delay is digitized and multiplied for adjusting it to the target sense timing. The variation of the generated timing was 34% smaller than that with a conventional technique and cycle time was reduced by 16% at the supply voltage of 0.6V in 40nm CMOS technology with this scheme.