Adrien Lavoie

Effect of Reaction Mechanism on Precursor Exposure Time in Atomic Layer Deposition of Silicon Oxide and Silicon Nitride

Atomic layer deposition (ALD) of highly conformal, silicon-based dielectric thin films has become necessary because of the continuing decrease in feature size in microelectronic devices. The ALD of oxides and nitrides is usually thought to be mechanistically similar, but plasma-enhanced ALD of silicon nitride is found to be problematic, while that of silicon oxide is straightforward. To find why, the ALD of silicon nitride and silicon oxide dielectric films was studied by applying ab initio methods to theoretical models for proposed surface reaction mechanisms. The thermodynamic energies for the elimination of functional groups from different silicon precursors reacting with simple model molecules were calculated using density functional theory (DFT), explaining the lower reactivity of precursors toward the deposition of silicon nitride relative to silicon oxide seen in experiments, but not explaining the trends between precursors. Using more realistic cluster models of amine and hydroxyl covered surfaces, the structures and energies were calculated of reaction pathways for chemisorption of different silicon precursors via functional group elimination, with more success. DFT calculations identified the initial physisorption step as crucial toward deposition and this step was thus used to predict the ALD reactivity of a range of amino-silane precursors, yielding good agreement with experiment. The retention of hydrogen within silicon nitride films but not in silicon oxide observed in FTIR spectra was accounted for by the theoretical calculations and helped verify the application of the model.

In situ XPS study of low temperature atomic layer deposition of B2O3 films on Si using BCl3 and H2O precursors

In this study, atomic layer deposition (ALD) of nanoscale boron oxide (B2O3) films on Si using BCl3/H2O precursors at room temperature was investigated using in situ x-ray photoelectron spectroscopy (XPS). B2O3 thin films are of considerable interest in ultra-shallow Si doping applications, including high aspect ratio FinFET structures, where film conformality and precise thickness control are crucial. ALD is therefore of particular interest for such applications. XPS data demonstrate that initial BCl3 exposures on Si at room temperature are self-limiting and are accompanied by partial B-Cl dissociation and Cl-Si formation. H2O exposures >1.7 × 108 Langmuir at room temperature removed Cl from B sites, but failed to remove Cl from the Cl-Si species. ALD-type growth of B2O3 was observed with an average growth rate of ∼2.5 A/cycle and without further increase in the Cl content. The initial Cl contamination was due to Cl-Si bond formation at the interface, without Cl incorporation into the oxide film. The role of Cl in the inhibition of oxide film growth was further investigated by the reactions of BCl3/O2 on SiO2 at room temperature and 650 K. BCl3/O2 precursors exhibit negligible B2O3 growth at room temperature. At 650 K, B2O3 growth was observed with a decreasing growth rate per BCl3/O2 cycle, corresponding to an increase in the Cl:B atomic ratio. These data indicate that room temperature ALD using BCl3/H2O precursors is a potential route toward the formation of uniform B2O3 films for shallow Si doping applications, but that Cl-Si formation significantly impacts initial oxide nucleation and growth.In this study, atomic layer deposition (ALD) of nanoscale boron oxide (B2O3) films on Si using BCl3/H2O precursors at room temperature was investigated using in situ x-ray photoelectron spectroscopy (XPS). B2O3 thin films are of considerable interest in ultra-shallow Si doping applications, including high aspect ratio FinFET structures, where film conformality and precise thickness control are crucial. ALD is therefore of particular interest for such applications. XPS data demonstrate that initial BCl3 exposures on Si at room temperature are self-limiting and are accompanied by partial B-Cl dissociation and Cl-Si formation. H2O exposures >1.7 × 108 Langmuir at room temperature removed Cl from B sites, but failed to remove Cl from the Cl-Si species. ALD-type growth of B2O3 was observed with an average growth rate of ∼2.5 A/cycle and without further increase in the Cl content. The initial Cl contamination was due to Cl-Si bond formation at the interface, without Cl incorporation into the oxide film. The rol...