Alex Waizman

Resonant free power network design using extended adaptive voltage positioning (EAVP) methodology

Extended adaptive voltage positioning (EAVP) is a new robust methodology for the design and analysis of a low impedance resonant free power delivery network, which utilizes and extends the theory of adaptive voltage positioning (AVP) that is commonly used in voltage regulator module (VRM) design and operation. Using EAVP, uncertainties in design guardband noise budget can be removed, resulting in significant performance bin-split improvement and cost reduction. Design optimization of decoupling capacitors with EAVP will be illustrated by using both time and frequency domain analysis.

CPU power supply impedance profile measurement using FFT and clock gating

CPU bypass mode clock gating and oscilloscope FFT features enable accurate measurement of a CPUs power delivery network impedance profile. The method described is self checking. Impedance profile characterization up to 100MHz is demonstrated.

Integrated power supply frequency domain impedance meter (IFDIM)

IFDIM is an integrated and self-checking on-die current throttling method that accurately measures CPUs power delivery impedance profile from the die up to the voltage regulator. Impedance profile characterization in 100Hz-600MHz frequency ranges is demonstrated.

Extended adaptive voltage positioning (EAVP) [power delivery network design]

The aim of this paper is to present a new robust approach, named extended adaptive voltage positioning (EAVP), to the design and analysis of a low impedance power delivery network. EAVP utilizes and extends on the theory of adaptive voltage positioning (AVP) that is commonly used in voltage regulator module (VRM) design and operation. Using EAVP, the authors demonstrate how uncertainties in design guardband noise budget can be removed, resulting in significant performance bin-split improvement and cost reduction. Design optimization of decoupling capacitors is illustrated using EAVP by using both time and frequency domain analysis.

CPU Power Delivery Impedance Profile Resonances Impact on Core FMAX

CPU core FMAX dependence on power delivery impedance profile resonances is investigated. Repetitive on/off stimulus degrades FMAX more than a step di/dt stimulus. Multiple resonances may have an additive effect on power supply voltage drops

CMOS ICs power-supply related decoupling properties

On-die decoupling plays important role in CMOS integrated circuits power delivery. A consistent extraction and modeling methodology of on-die inherent and intentional decoupling elements is presented. Measurements show accurate correlation to simulation of die capacitance.