Joseph M. Brand

Controlling packaging encapsulant leakage

Method of forming a synchronous-link dynamic random access memory edge-mounted device

Method and apparatus for removing encapsulating material from a packaged microelectronic device

Semiconductor device encapsulators

Integrated circuit device and synchronous-link dynamic random access memory device

Methods of forming a circuit and methods of preparing an integrated circuit

Circuit, method of adhering an integrated circuit device to a substrate, and method of forming a circuit

Microelectronic devices and methods for manufacturing and operating packaged microelectronic device assemblies

Method of encapsulating semiconductor devices utilizing a dispensing apparatus with rotating orifices

Method of forming heat sink and semiconductor chip assemblies