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Seng-Sooi Lim

LSI Corporation

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Publication

Featured researches published by Seng-Sooi Lim.

Archive | 1996

Apparatus and method for stackable molded lead frame ball grid array packaging of integrated circuits

Chok J. Chia; Seng-Sooi Lim; Qwai H. Low

Archive | 1997

Grooved semiconductor die for flip-chip heat sink attachment

Chok J. Chia; Seng-Sooi Lim; Maniam Alagaratnam

Archive | 1992

Partially-molded, PCB chip carrier package

Chok J. Chia; Seng-Sooi Lim

Archive | 1998

Thermally enhanced tape ball grid array package

Chok J. Chia; Seng-Sooi Lim; Owai H. Low

Archive | 1993

Partially-molded, PCB chip carrier package for certain non-square die shapes

Michael D. Rostoker; Chok J. Chia; Seng-Sooi Lim

Archive | 1991

Modified lead frame for reducing wire wash in transfer molding of IC packages

Chok J. Chia; Seng-Sooi Lim

Archive | 1996

Process for manufacturing a semiconductor device having a stiffener member

Seng-Sooi Lim; Ramaswamy Ranganathan; Sunil A. Patel

Archive | 1994

High power dissipating packages with matched heatspreader heatsink assemblies

Chok J. Chia; Manian Alagaratnam; Qwai H. Low; Seng-Sooi Lim

Archive | 1995

Method of improving molding of an overmolded package body on a substrate

Chok J. Chia; Seng-Sooi Lim; Maniam Alagaratnam

Archive | 1997

Molded array integrated circuit package

Chok J. Chia; Seng-Sooi Lim; Qwai H. Low

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Collaboration

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Chok J. Chia

LSI Corporation

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Qwai H. Low

LSI Corporation

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Maniam Alagaratnam

LSI Corporation

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Manian Alagaratnam

LSI Corporation

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Ramaswamy Ranganathan

Avago Technologies

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Patrick Variot

LSI Corporation

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Sunil A. Patel

LSI Corporation

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Michael D. Rostoker

LSI Corporation

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Owai H. Low

LSI Corporation

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Wee K. Liew

LSI Corporation

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