Chung-Chi Ko

Method for forming low dielectric constant damascene structure while employing carbon doped silicon oxide planarizing stop layer

Method for forming a capping layer over a low-k dielectric with improved adhesion and reduced dielectric constant

Method for ultra low-K dielectric deposition

Interconnects containing bilayer porous low-k dielectrics using different porogen to structure former ratio

Method for forming self-assembled mono-layer liner for Cu/porous low-k interconnections

Methods for Forming Interconnect Structures of Integrated Circuits

Method of and apparatus for active energy assist baking

Low-k Cu Barriers in Damascene Interconnect Structures

SiOC properties and its uniformity in bulk for damascene applications

Method for decreasing a dielectric constant of a low-k film