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Chung-Chi Ko

TSMC

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Publication

Featured researches published by Chung-Chi Ko.

Archive | 2002

Method for forming low dielectric constant damascene structure while employing carbon doped silicon oxide planarizing stop layer

Lain-Jong Li; Yung-Cheng Lu; Chung-Chi Ko

Archive | 2002

Method for forming a capping layer over a low-k dielectric with improved adhesion and reduced dielectric constant

Chung-Chi Ko; Yung-Cheng Lu; Lain-Jong Li; Lih-Ping Li; Yu-Huei Chen; Shu-E Ku

Archive | 2003

Method for ultra low-K dielectric deposition

Chung-Chi Ko; Yung-Cheng Lu; Tien-I Bao; Hui-Lin Chang; Syun-Ming Jang

Archive | 2007

Interconnects containing bilayer porous low-k dielectrics using different porogen to structure former ratio

Chen-Hua Yu; Yung-Cheng Lu; Pei-Ren Jeng; Chia-Cheng Chou; Keng-Chu Lin; Chung-Chi Ko; Tien-I Bao; Shwang-Ming Jeng

Archive | 2011

Method for forming self-assembled mono-layer liner for Cu/porous low-k interconnections

Chung-Chi Ko; Chia-Cheng Chou; Keng-Chu Lin; Tien-I Bao; Chen-Hua Yu

Archive | 2013

Methods for Forming Interconnect Structures of Integrated Circuits

Po-cheng Shih; Chung-Chi Ko; Keng-Chu Lin

Archive | 2010

Method of and apparatus for active energy assist baking

Chung-Chi Ko; Chia Cheng Chou; Keng-Chu Lin; Joung-Wei Liou; Shwang-Ming Jeng; Mei-Ling Chen

Archive | 2010

Low-k Cu Barriers in Damascene Interconnect Structures

Kuan-Chen Wang; Po-cheng Shih; Chung-Chi Ko; Keng-Chu Lin; Shwang-Ming Jeng

Archive | 2005

SiOC properties and its uniformity in bulk for damascene applications

Syun-Ming Jang; Chung-Chi Ko; Tien-I Bao; Lih-Ping Li; Ai-Sen Liu

Archive | 2005

Method for decreasing a dielectric constant of a low-k film

Chung-Chi Ko; Lih-Ping Li; Lain-Jong Li; Syun-Ming Jang

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Collaboration

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Keng-Chu Lin

TSMC

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Yung-Cheng Lu

TSMC

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Lih-Ping Li

TSMC

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Shwang-Ming Jeng

TSMC

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Chia-Cheng Chou

TSMC

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Tien-I Bao

TSMC

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Hui-Lin Chang

TSMC

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Lain-Jong Li

TSMC

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Syun-Ming Jang

TSMC

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Chen-Hua Yu

TSMC

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