Daniel M. Kuchta

A 71-Gb/s NRZ Modulated 850-nm VCSEL-Based Optical Link

We report error free (BER <; 10-12) operation of a directly non-return-to-zero modulated 850-nm vertical cavity surface-emitting laser (VCSEL) link operating to 71 Gb/s. This is the highest error free modulation rate for a directly modulated laser of any type. The optical link consists of a 130-nm BiCMOS driver IC with two-tap feed-forward equalization, a wide bandwidth 850-nm VCSEL, a surface illuminated GaAs PIN photodiode, and a 130-nm BiCMOS receiver IC.

160 Gb/s Bidirectional Polymer-Waveguide Board-Level Optical Interconnects Using CMOS-Based Transceivers

We have developed parallel optical interconnect technologies designed to support terabit/s-class chip-to-chip data transfer through polymer waveguides integrated in printed circuit boards (PCBs). The board-level links represent a highly integrated packaging approach based on a novel parallel optical module, or Optomodule, with 16 transmitter and 16 receiver channels. Optomodules with 16 Tx+16 Rx channels have been assembled and fully characterized, with transmitters operating at data rates up to 20 Gb/s for a 27-1 PRBS pattern. Receivers characterized as fiber-coupled 16-channel transmitter-to-receiver links operated error-free up to 15 Gb/s, providing a 240 Gb/s aggregate bidirectional data rate. The low-profile Optomodule is directly surface mounted to a circuit board using convention ball grid array (BGA) solder process. Optical coupling to a dense array of polymer waveguides fabricated on the PCB is facilitated by turning mirrors and lens arrays integrated into the optical PCB. A complete optical link between two Optomodules interconnected through 32 polymer waveguides has been demonstrated with each unidirectional link operating at 10 Gb/s achieving a 160 Gb/s bidirectional data rate. The full module-to-module link provides the fastest, widest, and most integrated multimode optical bus demonstrated to date.

Monolithic Silicon Integration of Scaled Photonic Switch Fabrics, CMOS Logic, and Device Driver Circuits

We demonstrate 4 × 4 and 8 × 8 switch fabrics in multistage topologies based on 2 × 2 Mach-Zehnder interferometer switching elements. These fabrics are integrated onto a single chip with digital CMOS logic, device drivers, thermo-optic phase tuners, and electro-optic phase modulators using IBMs 90 nm silicon integrated nanophotonics technology. We show that the various switch-and-driver systems are capable of delivering nanosecond-scale reconfiguration times, low crosstalk, compact footprints, low power dissipations, and broad spectral bandwidths. Moreover, we validate the dynamic reconfigurability of the switch fabric changing the state of the fabric using time slots with sub-100-ns durations. We further verify the integrity of high-speed data transfers under such dynamic operation. This chip-scale switching system technology may provide a compelling solution to replace some routing functionality currently implemented as bandwidth- and power-limited electronic switch chips in high-performance computing systems.

Chip-to-chip optical interconnects

Terabus is based on a silicon-carrier interposer on an organic card containing 48 polymer waveguides. We have demonstrated 4times12 arrays of low power optical transmitters and receivers, operating up to 20 Gb/s and 14 Gb/s per channel respectively

120-Gb/s VCSEL-based parallel-optical interconnect and custom 120-Gb/s testing station

A 120-Gb/s optical link (12 channels at 10 Gb/s/ch for both a transmitter and a receiver) has been demonstrated. The link operated at a bit-error rate of less than 10/sup -12/ with all channels operating and with a total fiber length of 316 m, which comprises 300 m of next-generation (OM-3) multimode fiber (MMF) plus 16 m of standard-grade MMF. This is the first time that a parallel link with this bandwidth at this per-channel rate has ever been demonstrated. For the transmitter, an SiGe laser driver was combined with a GaAs vertical-cavity surface-emitting laser (VCSEL) array. For the receiver, the signal from a GaAs photodiode array was amplified by a 12-channel SiGe receiver integrated circuit. Key to the demonstration were several custom testing tools, most notably a 12-channel pattern generator. The package is very similar to the commercial parallel modules that are available today, but the per-channel bit rate is three times higher than that for the commercial modules. The new modules demonstrate the possibility of extending the parallel-optical module technology that is available today into a distance-bandwidth product regime that is unattainable for copper cables.

15.6-Gb/s transmission over 1 km of next generation multimode fiber

In this letter, we report on a 15.6-Gb/s transmission over 1 km of next generation multimode fiber. The short wavelength vertical-cavity surface-emitting laser (VCSEL) transmitter module used a SiGe bipolar VCSEL driver. The multimode fiber was almost ideal and had a total differential mode delay width of only 0.056 ps/m. We also achieved 20-Gb/s transmission over 200 m.

A 20 Gb/s VCSEL driver with pre-emphasis and regulated output impedance in 0.13 /spl mu/m CMOS

Two 20 Gb/s optical transmitters are presented. They are a part of a 4/spl times/12 array intended for backplane data links. The drivers are fabricated in 0.13 /spl mu/m CMOS and include pre-emphasis and regulated output impedance. When coupled to 990 nm VCSELs, they provide optical modulation amplitude of 0 dBm and consume 70 mW and 120 mW.

A high-speed, high-sensitivity silicon lateral trench photodetector

We report a novel silicon lateral trench photodetector that decouples the carrier transit distance from the light absorption depth, enabling both high speed and high responsivity. The photodetector, fabricated with fully VLSI compatible processes, exhibits a 6-dB bandwidth of 1.5 GHz at 3.0 V and an external quantum efficiency of 68% at 845 nm wavelength. A photoreceiver with a wire-bonded lateral trench detector and a BiCMOS transimpedance amplifier demonstrates excellent operation at 2.5 Gb/s data rate and 845 nm wavelength with only a 3.3 V bias.

A 24-Channel, 300 Gb/s, 8.2 pJ/bit, Full-Duplex Fiber-Coupled Optical Transceiver Module Based on a Single “Holey” CMOS IC

We report here on the design, fabrication, and high-speed performance of a compact 48-channel optical transceiver module enabled by a key novel component: a “holey” Optochip. A single CMOS transceiver chip with 24 receiver (RX) and 24 laser diode driver circuits, measuring 5.2 mm × 5.8 mm, becomes a holey Optochip with the fabrication of forty-eight through-substrate optical vias (holes): one for each transmitter (TX) and RX channel. Twenty-four channel, 850-nm VCSEL and photodiode arrays are directly flip-chip soldered to the Optochip with their active devices centered on the optical vias such that optical I/O is accessed through the substrate of the CMOS IC. The holey Optochip approach offers numerous advantages: 1) full compatibility with top emitting/detecting 850-nm VCSELs/PDs that are currently produced in high volumes; 2) close integration of the VCSEL/PD devices with their drive electronics for optimized high-speed performance; 3) a small-footprint, chip-scale package that minimizes CMOS die cost while maximizing transceiver packing density; 4) direct coupling to standard 4 × 12 multimode fiber arrays through a 2-lens optical system; and 5) straightforward scaling to larger 2-D arrays of TX and RX channels. Complete transceiver modules, or holey Optomodules, have been produced by flip-chip soldering assembled Optochips to high-density, high-speed organic carriers. A pluggable connector soldered to the bottom of the Optomodule provides all module electrical I/O. The Optomodule footprint, dictated by the 1-mm connector pitch, is 21 mm × 21 mm. Fully functional holey Optomodules with 24 TX and 24 RX channels operate up to 12.5 Gb/s/ch achieving efficiencies (including both TX and RX) of 8.2 pJ/bit. The aggregate 300-Gb/s bi-directional data rate is the highest ever reported for single-chip transceiver modules.

End-to-End Multicore Multimode Fiber Optic Link Operating up to 120 Gb/s

A full multicore fiber optic link is demonstrated, transmitting greater than 100 Gb/s through a single strand of multimode fiber for the first time. The fiber, which consists of seven graded-index multimode cores, is used to transmit up to 120 Gb/s over 100 m using a custom multicore-fiber interfacing transmitter and receiver. 2-D arrays of vertical-cavity surface-emitting lasers (VCSELs) and vertically illuminated photodiodes (PDs) are fabricated with a geometry corresponding to the outer six cores of the seven-core fiber, which is arranged in a hexagonal pattern. Both flip-chip and wire-bonding technologies are used to package the VCSEL and PD chips with multichannel transmitter and receiver integrated circuits. Amplitude and timing margins of the end-to-end signals are analyzed through bit-error-rate (BER) measurements. The effects of electrical and optical crosstalk are shown to result in negligible degradation to the BER performance.