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Daniel Redfield

Applied Materials

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Publication

Featured researches published by Daniel Redfield.

Archive | 2015

Chemical mechanical polishing pad with internal channels

Jason Garcheung Fung; Rajeev Bajaj; Kasiraman Krishnan; Mahendra C. Orilall; Fred C. Redeker; Russell Edward Perry; Gregory E. Menk; Daniel Redfield

Archive | 2015

Polishing pads produced by an additive manufacturing process

Rajeev Bajaj; Daniel Redfield; Mahendra C. Orilall; Boyi Fu; Aniruddh Khanna; Jason Garcheung Fung; Mario Cornejo; Ashwin Chockalingam; Mayu Yamamura; Veera Raghava Reddy Kakireddy; Ashavani Kumar; Venkatachalam Hariharan; Gregory E. Menk; Fred C. Redeker; Nag B. Patibandla; Hou T. Ng; Robert E. Davenport; Amritanshu Sinha

Archive | 2014

ABSORBING REFLECTOR FOR SEMICONDUCTOR PROCESSING CHAMBER

Kin Pong Lo; Paul Brillhart; Satheesh Kuppurao; Daniel Redfield; Joseph M. Ranish; James Francis Mack; Kailash Kiran Patalay; Michael Olsen; Eddie Feigel; Richard Halpin; Brett Vetorino

Archive | 2017

TECHNIQUES FOR COMBINING CMP PROCESS TRACKING DATA WITH 3D PRINTED CMP CONSUMABLES

Jason Garcheung Fung; Rajeev Bajaj; Daniel Redfield; Aniruddh Khanna; Mario Cornejo; Gregory E. Menk; John Watkins

Archive | 2017

Method and apparatus for forming advanced polishing pads using an additive manufacturing process

Sivapackia Ganapathiappan; Boyi Fu; Ashwin Chockalingam; Daniel Redfield; Rajeev Bajaj; Mahendra C. Orilall; Hou T. Ng; Jason Garcheung Fung; Mayu Yamamura

Archive | 2016

ADVANCED POLISHING PAD MATERIALS AND FORMULATIONS

Rajeev Bajaj; Daniel Redfield; Mahendra C. Orilall; Boyi Fu; Ashwin Chockalingam

Archive | 2015

CMP pad construction with composite material properties using additive manufacturing processes

Rajeev Bajaj; Kasiraman Krishnan; Mahendra C. Orilall; Daniel Redfield; Fred C. Redeker; Nag B. Patibandla; Gregory E. Menk; Jason Garcheung Fung; Russell Edward Perry; Robert E. Davenport

Archive | 2017

PROCÉDÉ ET APPAREIL POUR FORMATION DE TAMPONS DE POLISSAGE PERFECTIONNÉS UTILISANT UN PROCESSUS DE FABRICATION ADDITIVE

Sivapackia Ganapathiappan; Boyi Fu; Ashwin Chockalingam; Daniel Redfield; Rajeev Bajaj; Mahendra C. Orilall; Hou T. Ng; Jason Garcheung Fung; Mayu Yamamura

Archive | 2017

ADVANCED POLISHING PADS HAVING COMPOSITIONAL GRADIENTS BY USE OF AN ADDITIVE MANUFACTURING PROCESS

Sivapackia Ganapathiappan; Boyi Fu; Ashwin Chockalingam; Daniel Redfield; Rajeev Bajaj; Mahendra C. Orilall; Hou T. Ng; Jason Garcheung Fung; Mayu Yamamura

Archive | 2017

APPARATUS AND METHOD OF FORMING A POLISHING PADS BY USE OF AN ADDITIVE MANUFACTURING PROCESS

Sivapackia Ganapathiappan; Boyi Fu; Ashwin Chockalingam; Daniel Redfield; Rajeev Bajaj; Mahendra C. Orilall; Hou T. Ng; Jason Garcheung Fung; Mayu Yamamura

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Collaboration

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Rajeev Bajaj

Applied Materials

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Mahendra C. Orilall

Applied Materials

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Jason Garcheung Fung

Applied Materials

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Ashwin Chockalingam

Applied Materials

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Boyi Fu

Applied Materials

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Mayu Yamamura

Applied Materials

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Fred C. Redeker

Applied Materials

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Gregory E. Menk

Applied Materials

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Hou T. Ng

Applied Materials

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Sivapackia Ganapathiappan

Applied Materials

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