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Dive into the research topics where Yoichi Hosokawa is active.

Publication


Featured researches published by Yoichi Hosokawa.


Archive | 1997

Semiconductor device, semiconductor chip mounting substrate, methods of manufacturing the device and substrate, adhesive, and adhesive double coated film

Kazunori Yamamoto; Yasushi Shimada; Yasushi Kumashiro; Teiichi Inada; Hiroyuki Kuriya; Aizou Kaneda; Takeo Tomiyama; Yoshihiro Nomura; Yoichi Hosokawa; Hiroshi Kirihara; Akira Kageyama


Archive | 1997

Semiconductor device, substrate for mounting semiconductor chip, processes for their production, adhesive, and double-sided adhesive film

Kazunori Yamamoto; Yasushi Shimada; Yasushi Kumashiro; Teiichi Inada; Hiroyuki Kuriya; Aizou Kaneda; Takeo Tomiyama; Yoshihiro Nomura; Yoichi Hosokawa; Hiroshi Kirihara; Akira Kageyama


Archive | 2002

SEMICONDUCTOR ELEMENT SURFACE PROTECTING FILM AND SEMICONDUCTOR ELEMENT UNIT

Yoichi Hosokawa; Hiroshi Kirihara; Michio Uruno; 宇留野 道生; 桐原 博; 細川 羊一


Archive | 2000

LOW-ELASTIC ADHESIVE, LOW-ELASTIC ADHESIVE MEMBER, SUBSTRATE FOR LOADING SEMICONDUCTOR HAVING LOW-ELASTIC ADHESIVE MEMBER AND SEMICONDUCTOR DEVICE USING THE SAME

Yoichi Hosokawa; Hiroshi Kirihara; Michio Uruno; 道生 宇留野; 博 桐原; 羊一 細川


Archive | 1998

SEMICONDUCTOR DEVICE WITH METAL REINFORCING MATERIAL

Yoichi Hosokawa; Shinji Iioka; Yoshihiro Nomura; Kazunori Yamamoto; 和徳 山本; 羊一 細川; 好弘 野村; 真志 飯岡


Archive | 1998

SEMICONDUCTOR DEVICE MANUFACTURED WITH DOUBLE-SIDED ADHESIVE FILM

Yoichi Hosokawa; Hiroshi Kirihara; Hiroyuki Kuritani; Yoshihiro Nomura; Yoshiyuki Tanabe; 弘之 栗谷; 博 桐原; 義行 田辺; 羊一 細川; 好弘 野村


Archive | 2001

Adhesive film for semiconductor, substrate for mounting semiconductor chip and semiconductor device

Yoichi Hosokawa; Maiko Kaneda; Takayuki Matsuzaki; Michio Uruno; 道生 宇留野; 隆行 松崎; 羊一 細川; 麻衣子 金田


Archive | 2002

Adhesive composition, adhesive film using the same and semiconductor device using the adhesive film

Yoichi Hosokawa; Maiko Kaneda; Michio Uruno; 宇留野 道生; 細川 羊一; 金田 麻衣子


Archive | 2001

Semiconductor device, substrate for mounting semiconductor chip and manufacturing method therefor, and adhesive and double-sided adhesive film

Yoichi Hosokawa; Teiichi Inada; Akira Kageyama; Yasushi Kamishiro; Aizo Kaneda; Hiroshi Kirihara; Hiroyuki Kuritani; Yoshihiro Nomura; Yasushi Shimada; Takeo Tomiyama; Kazunori Yamamoto; 健男 富山; 和徳 山本; 靖 島田; 晃 景山; 弘之 栗谷; 博 桐原; 恭 神代; 禎一 稲田; 羊一 細川; 好弘 野村; 愛三 金田


Archive | 1997

Acryl resin, adhesive and using the same, and production of acryl resin

Takao Hirayama; Yoichi Hosokawa; Toshihiko Ito; Hiroyuki Kuritani; Yoshihiro Nomura; Kazunori Yamamoto; 敏彦 伊藤; 和徳 山本; 隆雄 平山; 弘之 栗谷; 羊一 細川; 好弘 野村

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