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Dive into the research topics where Jen-Chou Tseng is active.

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Featured researches published by Jen-Chou Tseng.


international conference on ic design and technology | 2011

An ultra-low power K-band low-noise amplifier co-designed with ESD protection in 40-nm CMOS

Ming-Hsien Tsai; Shawn S. H. Hsu; Fu-Lung Hsueh; Chewn-Pu Jou; Tzu-Jin Yeh; Ming-Hsiang Song; Jen-Chou Tseng

This paper presents a K-band low noise amplifier (LNA) co-designed with ESD protection circuit in 40-nm CMOS technology. By treating ESD devices as a part of the input matching network, an ESD protected 24-GHz LNA is demonstrated with a NF of 3.2 dB under a power consumption of only 4.1 mW. The ESD protection network is composed of dual-diode and a gate-driven power clamp achieving an ESD level of 2.8 kV human body model (HBM). Owing to the co-design approach, the NF only degrades by 0.2 dB compared with the reference LNA without the ESD network. The ESD-LNA presents a power gain of 13.0 dB with the input and output return losses both greater than 10 dB. To the best of our knowledge, this is the first report on a 24-GHz ESD-protected LNA in 40-nm CMOS.


international microwave symposium | 2010

A 6.5kV ESD-protected low noise amplifier in 65-nm CMOS

Ming-Hsien Tsai; Fu-Lung Hsueh; Chewn-Pu Jou; Ming-Hsiang Song; Jen-Chou Tseng; Shawn S. H. Hsu; Sean Chen

A new ESD topology is proposed for RF low-noise amplifier (LNA). By using the modified silicon-controlled rectifier (MSCR) in conjunction with a P+/N-well diode clamp, a 5.8-GHz LNA with 6.5-kV ESD protection circuit is demonstrated by a 65-nm CMOS technology. Compared with the reference design, the new topology enhances the ESD level from 3.5 kV to 6.5 kV for human body model (HBM) while the noise figure (NF) is only 0.13 dB higher. Under a supply voltage of 1.2 V and drain current of 6.5 mA, the proposed ESD-protected LNA has a NF of 2.57 dB with an associated power gain of 16.7 dB. The input third-order intercept point (IIP3) is −11 dBm and the input and output return losses are below −15.9 dB and −20 dB, respectively.


electrical overstress electrostatic discharge symposium | 2016

An on-chip combo clamp for surge and universal ESD protection in bulk FinFET technology

Ming-Fu Tsai; Jen-Chou Tseng; Chung-Yu Huang; Tzu-Heng Chang; Kuo-Ji Chen; Ming-Hsiang Song

A surge protection consisted of the ready-made ESD clamp transistors has been designed and characterized in FINFET technology. It can endure all the stresses from CDM, HBM and Surge events. Compared to a conventional 0.7V RC-based core ESD clamp, the proposed cell greatly boosts the Surge immunity from 4V to 19V.


international conference on rfid | 2011

An analog front-end circuit with dual-directional SCR ESD protection for UHF-band passive RFID tag

Ming-Hsien Tsai; Shawn S. H. Hsu; Fu-Lung Hsueh; Chewn-Pu Jou; Ming-Hsiang Song; Jen-Chou Tseng; Tzu-Heng Chang; Dipankar Nag

In this study, we demonstrate an analog front-end (AFE) circuit with ESD protection for a passive RFID tag at UHF-band (860∼960 MHz) in a 0.18-μm CMOS technology. A dual-directional silicon-controlled-rectifier (dual-SCR) structure is proposed for the ESD protection under the large-signal operation at the RFID input. With the well-designed dual-SCR, a large trigger voltage (VT) of ∼ 16.9 V is obtained. The parasitic capacitance of the ESD block is only ∼ 34 fF, which has virtually no impact on the core circuits at the frequency of interest. The measured ESD levels achieve 3.0-kV human-body-mode (HBM) and 200-V machine-mode (MM), respectively. The RF-DC rectifier in the RFID circuit can generate a stable power supply output about 1.2 V when the RF input power exceeds −7.5 dBm.


electrical overstress electrostatic discharge symposium | 2015

Investigation and solution to the early failure of parasitic NPN triggered by the adjacent PNP ESD clamps

Ming-Fu Tsai; Jen-Chou Tseng; Kuo-Ji Chen; Ming-Hsiang Song

The mechanism of PNP-triggered parasitic NPNs early failure during ESD stress has been clarified for the first time. We proposed two solutions for the high ESD and Latchup-hard requirements. The embedded SCR structure provides high HBM immunity, which can serve pin-to-pin protection such as the differential IO application. For the Latchup-hard solution, a sandwich guard ring structure solves the snapback-induced local ESD damage issue and achieves low substrate current injection. Note that the spacing rule for the parasitic NPN structures is also greatly reduced up to 44.7%.


Archive | 2014

FinFET Body Contact and Method of Making Same

Ching-Hsiung Lo; Jam-Wem Lee; Wun-Jie Lin; Jen-Chou Tseng


electrical overstress electrostatic discharge symposium | 2012

High-k metal gate-bounded Silicon Controlled Rectifier for ESD protection

Tzu-Heng Chang; Yu-Ying Hsu; Jen-Chou Tseng; Jam-Wem Lee; Ming-Hsiang Song


Archive | 2012

Electrostatic discharge protection for three dimensional integrated circuit

Tzu-Heng Chang; Jen-Chou Tseng; Ming-Hsiang Song


Archive | 2014

APPARATUS FOR ESD PROTECTION

Wun-Jie Lin; Bo-Ting Chen; Jen-Chou Tseng; Ming-Hsiang Song


Archive | 2012

Fast Turn On Silicon Controlled Rectifiers for ESD Protection

Yu-Ti Su; Tzu-Heng Chang; Jen-Chou Tseng; Ming-Hsiang Song

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