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Dive into the research topics where John O. Jacobson is active.

Publication


Featured researches published by John O. Jacobson.


Archive | 1995

Method for packaging semiconductor dice

Warren M. Farnworth; Alan G. Wood; Trung T. Doan; John O. Jacobson


Archive | 1997

Interconnect for making temporary electrical connections with bumped semiconductor components

David R. Hembree; John O. Jacobson; James M. Wark; Warren M. Farnworth; Salman Akram; Alan G. Wood


Archive | 1999

Apparatus for testing semiconductor wafers

Warren M. Farnworth; Salman Akram; Alan G. Wood; David R. Hembree; James M. Wark; John O. Jacobson


Archive | 1998

System and interconnect for making temporary electrical connections with bumped semiconductor components

David R. Hembree; John O. Jacobson; James M. Wark; Warren M. Farnworth; Salman Akram; Alan G. Wood


Archive | 2003

Method for using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs

Salman Akram; Warren M. Farnworth; Derek Gochnour; David R. Hembree; Michael E. Hess; John O. Jacobson; James M. Wark; Alan G. Wood


Archive | 1997

Semiconductor package with pre-fabricated cover and method of fabrication

Warren M. Farnworth; David R. Hembree; Derek Gochnour; Salman Akram; John O. Jacobson; James M. Wark; Steven G. Thummel


Archive | 1995

Method and apparatus for automatically positioning electronic dice within component packages

Warren M. Farnworth; Alan G. Wood; John O. Jacobson; David R. Hembree; James M. Wark; Jennifer L. Folaron; Robert J. Folaron; Jay C. Nelson; Lelan D. Warren


Archive | 1999

Method for testing semiconductor components

Salman Akram; David R. Hembree; Warren M. Farnworth; Derek Gochnour; Alan G. Wood; John O. Jacobson


Archive | 2000

Flip-chip with matched lines and ground plane

Salman Akram; John O. Jacobson


Archive | 1998

Semiconductor package with pre-fabricated cover

Warren M. Farnworth; David R. Hembree; Derek Gochnour; Salman Akram; John O. Jacobson; James M. Wark; Steven G. Thummel

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