Salman Akram

Single piece package for semiconductor die

Stackable chip scale semiconductor package with mating contacts on opposed surfaces

Stacked leads-over chip multi-chip module

Method of producing a single piece package for semiconductor die

Method for fabricating stackable chip scale semiconductor package

Method for fabricating a self limiting silicon based interconnect for testing bare semiconductor dice

Method for fabricating semiconductor components using focused laser beam

Method for fabricating a semiconductor interconnect with laser machined electrical paths through substrate

Method for forming contact pins for semiconductor dice and interconnects

Method of constructing stacked packages