James M. Wark

Multi-dice chip scale semiconductor components and wafer level methods of fabrication

Device and method for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice

Packaged die on PCB with heat sink encapsulant

Through-wafer interconnects for photoimager and memory wafers

Method of fabricating flip-chip on leads devices and resulting assemblies

Thin film capacitor coupons for memory modules and multi-chip modules

Interconnect for making temporary electrical connections with bumped semiconductor components

Wafer level methods for fabricating multi-dice chip scale semiconductor components

Device and method for testing integrated circuit dice in an integrated circuit module

Force applying probe card and test system for semiconductor wafers