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Keith E. Downes

IBM

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Publication

Featured researches published by Keith E. Downes.

Archive | 2007

Dual-damascene process to fabricate thick wire structure

Douglas D. Coolbaugh; Keith E. Downes; Peter J. Lindgren; Anthony K. Stamper

Archive | 2006

Method of fabricating a precision buried resistor

Anil K. Chinthakindi; Douglas D. Coolbaugh; Keith E. Downes; Ebenezer E. Eshun; John E. Florkey; Heidi L. Greer; Robert M. Rassel; Anthony K. Stamper; Kunal Vaed

Archive | 2006

INTEGRATION OF A MIM CAPACITOR OVER A METAL GATE OR SILICIDE WITH HIGH-K DIELECTRIC MATERIALS

Anil K. Chinthakindi; Douglas D. Coolbaugh; Keith E. Downes; Ebenezer E. Eshun; Zhong-Xiang He; Robert M. Rassel; Anthony K. Stamper; Kunal Vaed

Archive | 2008

Method of Integration of a MIM Capacitor with a Lower Plate of Metal Gate Material Formed on an STI Region or a Silicide Region Formed in or on the Surface of a Doped Well with a High K Dielectric Material

Anil K. Chinthakindi; Douglas D. Coolbaugh; Keith E. Downes; Ebenezer E. Eshun; Zhong-Xiang He; Robert M. Rassel; Anthony K. Stamper; Kunal Vaed

Archive | 2005

Integration of a MIM capacitor with a plate formed in a well region and with a high-k dielectric

Anil K. Chinthakindi; Douglas D. Coolbaugh; Keith E. Downes; Ebenezer E. Eshun; Zhong-Xiang He; Robert M. Rassel; Anthony K. Stamper; Kunal Vaed

Archive | 2012

Process for single and multiple level metal-insulator-metal integration with a single mask

Anil K. Chinthakindi; Douglas D. Coolbaugh; Keith E. Downes; Ebenezer E. Eshun; Zhong-Xiang He; Robert M. Rassel; Anthony K. Stamper

Archive | 2007

Metal seed layer deposition

Steven P. Barkyoumb; Jonathan D. Chapple-Sokol; Edward C. Cooney; Keith E. Downes; Thomas L. McDevitt; William J. Murphy

Archive | 2010

METHOD AND STRUCTURE FOR CREATION OF A METAL INSULATOR METAL CAPACITOR

Ebenezer E. Eshun; Ronald J. Bolam; Douglas D. Coolbaugh; Keith E. Downes; Natalie B. Feilchenfeld; Zhong-Xiang He

Archive | 2007

Procede de double damasquinage pour la fabrication de structure de fil epais

Douglas D. Coolbaugh; Keith E. Downes; Peter J. Lindgren; Anthony K. Stamper

Archive | 2007

Doppel-damaszen-prozess zur herstellung einer dickdrahtstruktur

Douglas D. Coolbaugh; Keith E. Downes; Peter J. Lindgren; Anthony K. Stamper

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Collaboration

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Anthony K. Stamper

IBM

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Douglas D. Coolbaugh

GlobalFoundries

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Ebenezer E. Eshun

IBM

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Anil K. Chinthakindi

IBM

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Robert M. Rassel

IBM

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Zhong-Xiang He

IBM

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Kunal Vaed

IBM

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Peter J. Lindgren

IBM

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Edward C. Cooney

IBM

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William J. Murphy

IBM

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