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Latest external collaboration on country level. Dive into details by clicking on the dots.

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Dive into the research topics where Lisa A. Fanti is active.

Publication


Featured researches published by Lisa A. Fanti.


Archive | 2002

Sacrificial seed layer process for forming C4 solder bumps

Lisa A. Fanti; Randolph F. Knarr; Erik J. Roggeman; Kamalesh K. Srivastava


Archive | 1997

Process improvements for titanium-tungsten etching in the presence of electroplated C4's

Lawrence Daniel David; Lisa A. Fanti


Archive | 1997

Dry film resist removal in the presence of electroplated C4's

Gerald G. Advocate; Lisa A. Fanti; Henry A. Nye


Archive | 1999

Underfill preform interposer for joining chip to substrate

Joseph A. Benenati; William T. Chen; Lisa A. Fanti; Wayne J. Howell; John U. Knickerbocker


Archive | 1998

Process for stabilizing organic additives in electroplating of copper

Lisa A. Fanti


Archive | 1997

Copper anode assembly for stabilizing organic additives in electroplating of copper

Lisa A. Fanti


Archive | 2000

Electrochemical etch for high tin solder bumps

Lisa A. Fanti; John M. Cotte; David E. Eichstadt


Archive | 2005

Method of forming a bond pad on an I/C chip and resulting structure

Julie C. Biggs; Tien-Jen Cheng; David E. Eichstadt; Lisa A. Fanti; Jonathan H. Griffith; Randolph F. Knarr; Sarah H. Knickerbocker; Kevin S. Petrarca; Roger A. Quon; Wolfgang Sauter; Kamalesh K. Srivastava; Richard P. Volant


Archive | 2003

I/C chip suitable for wire bonding

Julie C. Biggs; Tien-Jen Cheng; David E. Eichstadt; Lisa A. Fanti; Jonathan H. Griffith; Randolph F. Knarr; Sarah H. Knickerbocker; Kevin S. Petrarca; Roger A. Quon; Wolfgang Sauter; Kamalesh K. Srivastava; Richard P. Volant


Archive | 2001

Method of improving uniformity of etching of a film on an article

Kamalesh K. Srivastava; Mary C. Cullinan-scholl; Lisa A. Fanti; Jonathan H. Griffith; Randolph F. Knarr

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