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Randolph F. Knarr

IBM

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Featured researches published by Randolph F. Knarr.

international symposium on vlsi technology, systems, and applications | 2007

Implementation of Robust Nickel Alloy Salicide Process for High-Performance 65nm SOI CMOS Manufacturing

Jay W. Strane; David E. Brown; Christian Lavoie; Jun Suenaga; Bala Haran; Patrick Press; Paul R. Besser; Philip L. Flaitz; Michael A. Gribelyuk; Thorsten Kammler; Igor Peidous; Huajie Chen; Stephan Waidmann; Asa Frye; Patrick W. DeHaven; Anthony G. Domenicucci; Conal E. Murray; Randolph F. Knarr; H.J. Engelmann; Christof Streck; Volker Kahlert; Sadanand V. Deshpande; Effendi Leobandung; John G. Pellerin; Jaga Jagannathan

Addition of Pt to Ni silicide produces a robust [NixPt(1-x)]Si, which shows an improved morphological stability, an important reduction in encroachment defect density, a reduced tendency to form NiSi2 and significant variations in monosilicide texture without degrading the device performance or the yield of high-performance 65 nm SOI technologies.

Archive | 2002

Sacrificial seed layer process for forming C4 solder bumps

Lisa A. Fanti; Randolph F. Knarr; Erik J. Roggeman; Kamalesh K. Srivastava

Archive | 2004

Method and process for forming a self-aligned silicide contact

Cyril Cabral; Michael A. Cobb; Asa Frye; Balasubramanian S. Haran; Randolph F. Knarr; Mahadevaiyer Krishnan; Christian Lavoie; Andrew P. Mansson; Renee T. Mo; Jay W. Strane; Horatio S. Wildman

Archive | 1990

Tetra aza ligand systems as complexing agents for electroless deposition of copper

Rangarajan Jagannathan; Randolph F. Knarr; Mahadevaiyer Krishnan; Gregory Peter Wandy

Archive | 2006

Structure and method of forming electrodeposited contacts

Cyril Cabral; Hariklia Deligianni; Randolph F. Knarr; Sandra G. Malhotra; Stephen M. Rossnagel; Xiaoyan Shao; Anna W. Topol; Philippe M. Vereecken

Archive | 2009

Method for forming self-aligned metal silicide contacts

Sunfei Fang; Randolph F. Knarr; Mahadevaiyer Krishnan; Christian Lavoie; Renee T. Mo; Balasubramanian Pranatharthiharan; Jay W. Strane

Archive | 2002

Low impedance power distribution structure for a semiconductor chip package

Brent A. Anderson; Randolph F. Knarr; Sarah H. Knickerbocker; Edmund J. Sprogis; Kamalesh K. Srivastava

Langmuir | 1998

Direct Force Measurements at the Smooth Gold/Mica Interface

Randolph F. Knarr; Roger A. Quon; T. Kyle Vanderlick

Archive | 2010

Method of forming electrodeposited contacts

Cyril Cabral; Lili Deligianni; Randolph F. Knarr; Sandra G. Malhotra; Stephen M. Rossnagel; Xiaoyan Shao; Anna W. Topol; Philippe M. Vereecken

Archive | 2003

ENCAPSULATED PIN STRUCTURE FOR IMPROVED RELIABILITY OF WAFER

Tien-Jen Cheng; David E. Eichstadt; Jonathan H. Griffith; Randolph F. Knarr; Kevin S. Petrarca; Roger A. Quon

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Christian Lavoie

IBM

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Jonathan H. Griffith

IBM

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David E. Eichstadt

IBM

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Kamalesh K. Srivastava

IBM

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Mahadevaiyer Krishnan

IBM

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Anna W. Topol

IBM

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Cyril Cabral

IBM

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Jay W. Strane

IBM

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Kevin S. Petrarca

IBM

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Lisa A. Fanti

IBM

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