David E. Eichstadt | Researchain

Archive Network Publication Hotspot Collaboration

Network

Latest external collaboration on country level. Dive into details by clicking on the dots.

Explore More

Hotspot

Dive into the research topics where David E. Eichstadt is active.

Explore More

Publication

Featured researches published by David E. Eichstadt.

Archive | 2004

Compressible films surrounding solder connectors

William E. Bernier; Tien-Jen Cheng; Marie S. Cole; David E. Eichstadt; Mukta G. Farooq; John A. Fitzsimmons; Lewis S. Goldmann; John U. Knickerbocker; David J. Welsh

Archive | 2004

Method for forming robust solder interconnect structures by reducing effects of seed layer underetching

Kamalesh K. Srivastava; Subhash L. Shinde; Tien-Jen Cheng; Sarah H. Knickerbocker; Roger A. Quon; William E. Sablinski; Julie C. Biggs; David E. Eichstadt; Jonathan H. Griffith

Archive | 2003

Compliant electrical contacts

William E. Bernier; David E. Eichstadt; Mukta G. Farooq; John U. Knickerbocker

Archive | 2003

Method for selective electroplating of semiconductor device i/o pads using a titanium-tungsten seed layer

Tien-Jen Cheng; David E. Eichstadt; Jonathan H. Griffith; Sarah H. Knickerbocker; Rosemary A. Previti-Kelly; Roger A. Quon; Kamalesh K. Srivastava; Keith Kwong Hon Wong

Archive | 2004

DEVICE WITH AREA ARRAY PADS FOR TEST PROBING

Tien-Jen Cheng; David E. Eichstadt; Jonathan H. Griffith; Sarah H. Knickerbocker; Samuel Roy McKnight; Kevin S. Petrarca; Kamalesh K. Srivastava; Roger A. Quon

Archive | 2003

ENCAPSULATED PIN STRUCTURE FOR IMPROVED RELIABILITY OF WAFER

Tien-Jen Cheng; David E. Eichstadt; Jonathan H. Griffith; Randolph F. Knarr; Kevin S. Petrarca; Roger A. Quon

Archive | 2000

Electrochemical etch for high tin solder bumps

Lisa A. Fanti; John M. Cotte; David E. Eichstadt

Archive | 2009

Forming robust solder interconnect structures by reducing effects of seed layer underetching

Kamalesh K. Srivastava; Subhash L. Shinde; Tien-Jen Cheng; Sarah H. Knickerbocker; Roger A. Quon; William E. Sablinski; Julie C. Biggs; David E. Eichstadt; Jonathan H. Griffith

Archive | 2005

Method of forming a bond pad on an I/C chip and resulting structure

Julie C. Biggs; Tien-Jen Cheng; David E. Eichstadt; Lisa A. Fanti; Jonathan H. Griffith; Randolph F. Knarr; Sarah H. Knickerbocker; Kevin S. Petrarca; Roger A. Quon; Wolfgang Sauter; Kamalesh K. Srivastava; Richard P. Volant

Archive | 2003