Mehdi Vaez-Iravani

Wafer inspection technology challenges for ULSI manufacturing

The use of wafer inspection systems in managing semiconductor manufacturing yields is described. These systems now detect defects of size as small as 40 nm. Some high-speed systems have achieved 200-mm diameter wafer throughputs of 150 wafers per hour. The particular technologies involved are presented. Extensions of these technologies to meet the requirements of manufacturing integrated circuits with smaller structures on larger wafers are discussed.

How lasers and optics help increase semiconductor manufacturing yield

Summary form only given. We discuss the requirements of, and solutions for, the inspection problems for the ULSI technology. Preferred embodiments for specific detection problems are described, and the possible limitations, and extensions, of the relevant technologies are discussed.