Muneo Fukaishi
NEC
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Featured researches published by Muneo Fukaishi.
international solid-state circuits conference | 2006
Noriyuki Miura; Daisuke Mizoguchi; Mari Inoue; Kiichi Niitsu; Yoshihiro Nakagawa; Masamoto Tago; Muneo Fukaishi; Takayasu Sakurai; Tadahiro Kuroda
A 1Tb/s 3W inter-chip transceiver transmits clock and data by inductive coupling at a clock rate of 1GHz and data rate of 1Gb/s per channel. 1024 data transceivers are arranged with a pitch of 30mum. The total layout area is 2mm2 in 0.18mum CMOS and the chip thickness is 10mum. 4-phase TDMA reduces crosstalk and the BER is <10minus;12. Bi-phase modulation is used to improve noise immunity, reducing power in the transceiver
international solid state circuits conference | 2007
Noriyuki Miura; Daisuke Mizoguchi; Mari Inoue; Kiichi Niitsu; Yoshihiro Nakagawa; Masamoto Tago; Muneo Fukaishi; Takayasu Sakurai; Tadahiro Kuroda
A 1 Tb/s 3 W inter-chip transceiver transmits clock and data by inductive coupling at a clock rate of 1 GHz and data rate of 1 Gb/s per channel. 1024 data transceivers are arranged with a pitch of 30 mum in a layout area of 1 mm2. The total layout area including 16 clock transceivers is 2 mm2 in 0.18 mum CMOS and the chip thickness is reduced to 10 mum. Bi-phase modulation (BPM) is employed for the data link to improve noise immunity, reducing power in the transceiver. Four-phase time division multiple access (TDMA) reduces crosstalk and the bit-error rate (BER) is lower than 10-13
international solid-state circuits conference | 2005
Kouichi Yamaguchi; Kazuhisa Sunaga; Shunichi Kaeriyama; Takaaki Nedachi; Makoto Takamiya; Kouichi Nose; Yoshihiro Nakagawa; Mitsutoshi Sugawara; Muneo Fukaishi
A backplane transceiver in 90 nm CMOS that employs duobinary signaling over copper traces is described. To introduce duobinary signaling into data transfers on printed boards, three techniques are developed: 1) edge equalization for equalizer adaptation; 2) 2/spl times/ oversampled transmitter equalizer for ISI control; and 3) 2b-transition-ensure encoding for clock recovery.
international solid state circuits conference | 2010
Takashi Tokairin; Mitsuji Okada; Masaki Kitsunezuka; Tadashi Maeda; Muneo Fukaishi
A 2.1-to-2.8-GHz low-power consumption all-digital phase locked loop (ADPLL) with a time-windowed time-to-digital converter (TDC) is presented. The time-windowed TDC uses a two-step structure with an inverter- and a Vernier-delay time-quantizer to improve time resolution, which results in low phase noise. Time-windowed operation is implemented in the TDC, in which a single-shot pulse-based operation is used for low power consumption. The test chip implemented in 90-nm CMOS technology exhibits in-band phase noise of , where the loop-bandwidth is set to 500 kHz with a 40-MHz reference signal, and out-band noise of at a 1-MHz offset frequency. The chip core occupies 0.37 and the measured power consumption is 8.1 mA from a 1.2-V power supply.
symposium on vlsi circuits | 2000
Kazuyuki Nakamura; Muneo Fukaishi; Yoshinori Hirota; Youetsu Nakazawa; Michio Yotsuyanagi
The authors report a duty cycle repeater (DCR) which obtains 50% duty-cycle complementary clock signals from a wide range of input duty-cycle signals from 30% to 70%, even when input signals suffer from timing skew. It features a simple CMOS structure, with a newly developed complementary phase blending architecture and a symmetrical phase blending inverter.
IEEE Journal of Solid-state Circuits | 2010
Alexandre Siligaris; Yasuhiro Hamada; Christopher Mounet; C. Raynaud; Baudouin Martineau; Nicolas Deparis; Nathalie Rolland; Muneo Fukaishi; Pierre Vincent
A 60 GHz wideband power amplifier (PA) is fabricated in a standard CMOS SOI 65 nm process. The PA is based on two cascode stages. Input, output and inter-stage matching use coplanar wave guide (CPW) transmission lines that have low losses thanks to the high-resistivity SOI substrate (3 kΩ · cm). The PA measurements are carried out for supply voltages VDD going from 1.2 V to 2.6 V and achieve a saturation power of 10 dBm to 16.5 dBm respectively. The peak power-added efficiency (PAE) is higher than 20% for all applied VDD values.
IEEE Journal of Solid-state Circuits | 2003
Yoshiharu Kudoh; Muneo Fukaishi; Masayuki Mizuno
The frequency-dependent attenuation of the transmission lines between chips and printed circuit boards, for example, is an obstacle to improving the performance of a system enhanced with LSI technology scaling. This is because large frequency-dependent attenuation results in poor eye-opening performance and a high bit-error rate in data transmission. This paper presents a 5-Gb/s 10-m 28AWG cable transceiver fabricated by using 0.13-/spl mu/m CMOS technology. In this transceiver, a continuous-time post-equalizer, with recently developed no-feedback-loop high-speed analog amplifiers, can handle up to 9dB of frequency-dependent attenuation in cables and also achieve an 18-dB improvement in the attenuation (27dB total improvement) by using pre- and post-equalization techniques in combination.
IEEE Journal of Solid-state Circuits | 2012
Masaki Kitsunezuka; Hiroshi Kodama; Naoki Oshima; Kazuaki Kunihiro; Tadashi Maeda; Muneo Fukaishi
A 30-MHz-2.4-GHz complementary metal oxide semiconductor (CMOS) receiver with an integrated tunable RF filter and a dynamic-range-scalable energy detector for both white-space and interference-level sensing in cognitive radio systems is reported. The second-order RF filter has only two stacked transistors, and its use, in combination with a subsequent harmonic rejection mixer, results in wideband interference rejection. The energy detector with programmable rectifiers provides dynamic-range (DR) scalability, enabling shared use for white-space/interference-level detection and automatic gain control. A prototype chip, fabricated using 90-nm CMOS technology, achieved over 42-dB harmonic rejection including 7th-order component without any external device, a 67-dB gain, a 5-8-dB noise figure, a -11-dBm in-band third-order intercept point, and a +38-dBm second-order intercept point while drawing only 25-37 mA from a 1.2-V power supply. Multi-resolution DR-scalable spectrum sensing with a 0.2-30-MHz detection bandwidth, -83-dBm minimum sensitivity, and a 29-48-dB DR was demonstrated.
international solid-state circuits conference | 1998
Muneo Fukaishi; Kazuyuki Nakamura; Masaharu Sato; Yutaka Tsutsui; Syuji Kishi; Michio Yotsuyanagi
A single-chip 4.25 Gb/s 32:1, 1:32 transceiver, meeting the emerging ANSI fiber channel (FC) standard, uses 0.25 /spl mu/m CMOS technology. To achieve 4.25 Gb/s operation, the features include: 1) an asynchronous tree-type 1:8 demultiplexer (DEMUX), 2) an 8 b to 10 b parallel-to-parallel frequency converter, and 3) comma-detection and word-alignment logic. The transceiver consumes 600 mW in 4.25 Gb/s operation with a 2.5 V supply. Higher-speed operation that that of a previous CMOS FC design is achieved.
symposium on vlsi circuits | 1998
Kazuyuki Nakamura; Muneo Fukaishi; H. Abiko; A. Matsumoto; Michio Yotsuyanagi
We developed a new phase detector which can perform 1:2 data demultiplexing function. A newly developed pulse compensation technique enables one to output the analog phase difference for a half-frequency clock. This circuit can be used as both a phase detector for a PLL clock recovery circuit (CRC) and a root module for an asynchronous tree-type DEMUX. Using a new combined CRC-DEMUX structure, we achieved 6 Gbps 1:8 DEMUX with CRC using a 0.18 /spl mu/m CMOS in 83 mW power consumption.