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Po-Hao Tsai

TSMC

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Publication

Featured researches published by Po-Hao Tsai.

Archive | 2010

TSVs with different sizes in interposers for bonding dies

Po-Hao Tsai; Jing-Cheng Lin; Chen-Hua Yu

Archive | 2012

Connector Design for Packaging Integrated Circuits

Chen-Hua Yu; Shin-puu Jeng; Shang-Yun Hou; Cheng-chieh Hsieh; Kuo-Ching Hsu; Ying-Ching Shih; Po-Hao Tsai; Chin-Fu Kao; Cheng-Lin Huang; Jing-Cheng Lin

Archive | 2011

Packaging Structures and Methods

Chen-Hua Yu; Shin-puu Jeng; Shang-Yun Hou; Kuo-Ching Hsu; Cheng-chieh Hsieh; Ying-Ching Shih; Po-Hao Tsai; Cheng-Lin Huang; Jing-Cheng Lin

Archive | 2014

Pillar Design for Conductive Bump

Cheng-chieh Hsieh; Cheng-Lin Huang; Po-Hao Tsai; Shang-Yun Hou; Jing-Cheng Lin; Shin-puu Jeng

Archive | 2011

SELF-ALIGNING CONDUCTIVE BUMP STRUCTURE AND METHOD OF MAKING THE SAME

Cheng-Lin Huang; I-Ting Chen; Ying Ching Shih; Po-Hao Tsai; Szu Wei Lu; Jing-Cheng Lin; Shin-puu Jeng; Chen-Hua Yu

Archive | 2017

Multi-die structure and method of forming same

Chen-Hua Yu; Po-Hao Tsai; Jing-Cheng Lin; Li-Hui Cheng

Archive | 2016

SEMICONDUCTOR PACKAGE MANUFACTURING METHOD

Jing-Cheng Lin; Po-Hao Tsai; Ying Ching Shih; Szu Wei Lu

Archive | 2013

Packaging Structures and Methods with a Metal Pillar

Chen-Hua Yu; Shin-puu Jeng; Shang-Yun Hou; Kuo-Ching Hsu; Cheng-chieh Hsieh; Ying-Ching Shih; Po-Hao Tsai; Cheng-Lin Huang; Jing-Cheng Lin

Archive | 2011

3D IC packaging structures and methods with a metal pillar

Chen-Hua Yu; Shin-puu Jeng; Shang-Yun Hou; Kuo-Ching Hsu; Cheng-chieh Hsieh; Ying-Ching Shih; Po-Hao Tsai; Cheng-Lin Huang; Jing-Cheng Lin

Archive | 2015

SELF-ALIGNING CONDUCTIVE BUMP STRUCTURE AND METHOD OF FABRICATION

Cheng-Lin Huang; I-Ting Chen; Ying Ching Shih; Po-Hao Tsai; Szu Wei Lu; Jing-Cheng Lin; Shin-puu Jeng; Chen-Hua Yu

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Jing-Cheng Lin

TSMC

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Cheng-Lin Huang

TSMC

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Chen-Hua Yu

TSMC

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Shin-puu Jeng

TSMC

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Cheng-chieh Hsieh

TSMC

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Shang-Yun Hou

TSMC

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Ying-Ching Shih

TSMC

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Kuo-Ching Hsu

TSMC

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Szu Wei Lu

TSMC

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I-Ting Chen

TSMC

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