Peter A. Benson

Microelectronic devices, methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices

Wafer edge ring structures and methods of formation

Packaged microelectronic imaging devices and methods of packaging microelectronic imaging devices

Low temperature methods of forming back side redistribution layers in association with through wafer interconnects, semiconductor devices including same, and assemblies

Integrated optics units and methods of manufacturing integrated optics units for use with microelectronic imagers

Microelectronic imagers and methods of packaging microelectronic imagers

Wafer-level packaged microelectronic imagers and processes for wafer-level packaging

Methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices

Methods for packaging microfeature devices and microfeature devices formed by such methods

Method for creating electrically conductive elements for semiconductor device structures using laser ablation processes and methods of fabricating semiconductor device assemblies