Takehiko Hamada

A 30-ns 256-Mb DRAM with a multidivided array structure

A 256-Mb DRAM with a multidivided array structure has been developed and fabricated with 0.25- mu m CMOS technology. It features 30-ns access time, 16-b I/Os, and a 35-mA operating current at a 60-ns cycle time. Three key circuit technologies were used in its design: a partial cell array activation scheme for reducing power-line voltage bounce and operating current, a selective pull-up data-line architecture to increase I/O width and reduce power dissipation, and a time-sharing refresh scheme to maintain the conventional refresh period without reducing operational margin. Memory cell size was 0.72 mu m/sup 2/. Use of the trench isolated cell transistor and the HSG cylindrical stacked capacitor cells helped reduce chip size to 333 mm/sup 2/. >

Application of a bitmap analysis system to the forefront of DRAM devices development

A bitmap analysis system with a shape classification has been developed for use in manufacturing of forefront DRAM devices. This system shortens the time needed to improve the processing conditions according to the results of failure analysis. This system is a part of a total yield enhancement system have already been put to practical use in mass production.