Tien-Jen Cheng | Researchain

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Publication

Featured researches published by Tien-Jen Cheng.

Archive | 2008

CONFORMAL ADHESION PROMOTER LINER FOR METAL INTERCONNECTS

Tien-Jen Cheng; Zhengwen O. Li; Keith Kwong Hon Wong; Huilong Zhu

Archive | 2004

METHOD AND APPARATUS FOR CONTROLLING LOCAL CURRENT TO ACHIEVE UNIFORM PLATING THICKNESS

Tien-Jen Cheng; Todd M. Fowler; Ajay P. Giri; Anton Nenadic; Blessen Samuel; Keith Kwong Hon Wong

Archive | 2011

Chemical Bath Replenishment

Tien-Jen Cheng; John A. Fitzsimmons; David E. Speed; Keith Kwong Hon Wong

Archive | 2004

Method for controlling local current to achieve uniform plating thickness

Tien-Jen Cheng; Todd M. Fowler; Ajay P. Giri; Anton Nenadic; Blessen Samuel; Keith Kwong Hon Wong

Archive | 1998

Process for producing corrosion-resistant terminal metal pads for thin film packages

Tien-Jen Cheng; Ajay P. Giri; Ashwani K. Malhotra; John R. Pennacchia; Eric D. Perfecto; Roy Yu

Archive | 2015

Metal to metal bonding for stacked (3d) integrated circuits

Tien-Jen Cheng; Mukta G. Farooq; John A. Fitzsimmons

Archive | 2010

Selective copper encapsulation layer deposition

Tien-Jen Cheng; Abhishek Dube; Zhengwen Li; Huilong Zhu

Archive | 2000

Corrosion-resistant terminal metal pads for thin film packages

Tien-Jen Cheng; Ajay P. Giri; Ashwani K. Malhotra; John R. Pennacchia; Eric D. Perfecto; Roy Yu

Archive | 2010

Method for removing copper oxide layer

Tien-Jen Cheng; Stephan Grunow; Zhengwen Li; Huilong Zhu

Archive | 2003

Method and device for realizing uniform plating thickness by controlling local current

Tien-Jen Cheng; Todd M. Fowler; Ajay P. Giri; Anton Nenadic; Blessen Samuel; Keith Kwong Hon Wong; アジェイ・ギリ; アントン・ネナディク; ケイス・クォンホン・ウォン; ティエン・ジェン・チェン; トッド・ファウラー; ブレセン・サミュエル

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