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Proceedings of International Conference on Planarization/CMP Technology 2014 | 2014

Nano size cerium hydroxide slurry for scratch-free CMP process

Takaaki Tanaka; Hisataka Minami; Toshiaki Akutsu; Tomohiro Iwano; Takahiro Hidaka; Takashi Shinoda; Haruaki Sakurai; Shigeru Nobe

We report recent progress in a novel cerium hydroxide polishing slurry with particle size of about 5 nm nano size cerium hydroxide (NSC) abrasive. NSC has succeeded in omitting particles over 1 μm, and in reducing scratches to 1/30 of those with calcined ceria slurry. Even though, NSC maintains oxide removal rate similar to conventional ceria. Mixing NSC with the specific additives brought out tunable polishing of SiO2, SiN, and poly-Si.


Archive | 2005

Cmp polishing agent and method for polishing substrate

Masato Fukasawa; Naoyuki Hitachi Chemical Co. Ltd. Koyama; Yasushi Kurata; Kouji Hitachi Chemical Co. Ltd. Haga; Toshiaki Akutsu; Yuuto Ootsuki


Archive | 2005

CMP polishing slurry and method of polishing substrate

Masato Fukasawa; Naoyuki Koyama; Kouji Haga; Toshiaki Akutsu


Archive | 2010

CMP POLISHING LIQUID, METHOD FOR POLISHING SUBSTRATE, AND ELECTRONIC COMPONENT

Takashi Shinoda; Kazuhiro Enomoto; Toshiaki Akutsu


Archive | 2006

Polishing slurry for silicon oxide, additive liquid and polishing method

Masaya Nishiyama; Kazuhiro Enomoto; Masato Fukasawa; Toshiaki Akutsu; Yuuto Otsuki; Toranosuke Ashizawa


Archive | 2013

POLISHING AGENT, POLISHING AGENT SET, AND SUBSTRATE POLISHING METHOD

Toshiaki Akutsu; Hisataka Minami; Tomohiro Iwano; Koji Fujisaki


Archive | 2006

Polishing agent for silicon oxide, liquid additive, and method of polishing

Masaya Nishiyama; Masato Fukasawa; Toshiaki Akutsu; Kazuhiro Enomoto; Toranosuke Ashizawa; Yuuto Ootsuki


Archive | 2015

Polishing agent, polishing agent set and method for polishing base

Toshiaki Akutsu; Hisataka Minami; Tomohiro Iwano; Koji Fujisaki


Archive | 2013

Slurry, polishing-solution set, polishing solution, substrate polishing method, and substrate

Tomohiro Iwano; 友洋 岩野; Hisataka Minami; 久貴 南; Toshiaki Akutsu; 利明 阿久津; Koji Fujisaki; 耕司 藤崎


Archive | 2013

ABRASIVE, ABRASIVE SET, AND METHOD FOR ABRADING SUBSTRATE

Hisataka Minami; Toshiaki Akutsu; Tomohiro Iwano; Koji Fujisaki

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