Yehiel Gotkis
Lam Research
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Publication
Featured researches published by Yehiel Gotkis.
advanced semiconductor manufacturing conference | 2002
Yehiel Gotkis; David Wei; Rodney Kistler
Two major conceptual CMP approaches, namely flexible polishing surface (utilized in linear belt CMP) and rigid polishing surface (hard platen rotary and orbital CMP) concepts are compared with regard to process stability, uniformity, planarization efficiency and other performance features. A new CMP characteristic, Normalized Removal Work, the amount of wafer layer material removed by a unit of active pad area (NRW=(Thickness removed)/(Active pad area), [A/sq. inch]), is used to analyze and compare the concepts. The NRW shows how much of the removed material is transferred and redeposited over a unit of pad area. It influences all aspects of the CMP process. Low NRW is good for CMP, high NRW is bad for CMP.
Archive | 2001
Yehiel Gotkis
Archive | 2001
Rod Kistler; Yehiel Gotkis
Archive | 2002
Aleksander Owczarz; Yehiel Gotkis; David Hemker; Rodney Kistler
Archive | 2004
Yehiel Gotkis; Rodney Kistler; Aleksander Owczarz; David Hemker; Nicolas J. Bright
Archive | 2001
John M. Boyd; Yehiel Gotkis; Rod Kistler
Archive | 2002
Yehiel Gotkis; Aleksander Owczarz; David Hemker; Nicolas J. Bright; Rodney Kistler
Archive | 2004
Rodney Kistler; David Hemker; Yehiel Gotkis; Aleksander Owczarz; Bruno Morel; Damon Vincent Williams
Archive | 2004
Yehiel Gotkis; Robert Charatan
Archive | 2001
Yehiel Gotkis; David Wei; Rodney Kistler
